Jobs / United States / Intel Corporation
Module Engineering PhD Intern New 2027
Intel Corporation · 🇺🇸 US, Oregon, Hillsboro
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles50 certified filings for “Engineering Manager” (Architectural and Engineering Managers) in OR: $182k–$209k, median $182k. Most were filed at wage level III (52%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Last confirmed live 2 days agoWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: As one of the world's largest chip manufacturers, and a global leader in innovative technology, Intel strives to make every facet of semiconductor manufacturing state-of-the-art from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world-class Supply Chain and facilities support. Join us at Intel Foundry Logic Technology Development (LTD) for a Graduate internship and participate in creating the next generation of technologies that will shape the future for decades to come. LTD intern would conduct scientific research to enable manufacturing of innovative device architectures. They would engage in designing, executing and analyzing experiments necessary to meet engineering specifications for their process, and participate in process and equipment development. The Role and Impact In this role, you will contribute to module process development, process integration flows, and equipment configuration for manufacturing modules. Work may also include support for yield improvement initiatives by analyzing defect data, conducting experiments, and assisting in risk assessments. You will work in collaboration with engineering teams to optimize metrology strategies, troubleshoot process flow issues, and continuously improve the process in preparation for high-volume manufacturing environment. As an intern, you will have an opportunity to learn and apply your knowledge, build skills, and explore future career opportunities through hands-on experience and projects that support Intel business goals in a collaborative environment. Business group As part of Intel Foundry, you will join Logic Technology Development (LTD) Metals team that focuses on Metals Thin Films Deposition within semiconductor manufacturing. The Logic Technology Development (LTD) organization delivers the latest process technology innovations to drive Intel's product roadmap. We foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. The team supports Intel's broader mission of driving innovation and delivering high-quality solutions to meet global technological demands. Key Responsibilities • Contribute to process development, continuous improvement, and implementation of semiconductor manufacturing processes for a specific module within LTD Metals. to help develop and improve our processes • Design, execute, analyze experiments and present conclusions and recommendations to the group • Collaborate with fab technicians and support experiment execution with clear instructions • Assist engineering teams in process flow troubleshooting and metrology optimization strategies • Apply statistical analysis and design experiments to enhance process reliability and throughput. • Gain experience in materials and device characterization techniques, such as ellipsometry, xray-based techniques, 4-point probe, AFM, SEM and TEM. Qualifications: Minimum Qualifications • PhD student in Chemical Engineering, Electrical Engineering, Material Science, Physics, Chemistry, Mechanical Engineering, or a related field of study. • Knowledge of semiconductor processing fundamentals, including thin films deposition, lithography, etching, polishing. • Experience in thin films materials deposition techniques (ALD, CVD, PVD or electroplating) and characterization (ellipsometry, XRF, XPS, XRR, 4-point probe, AFM, SEM, TEM, etc.), hands-on lab/fab equipment experience • Data analysis skills with demonstrated ability to construct clear data-based problem statements, design of experiment Preferred Qualifications • PhD student 3rd or 4th year; experience with thin film deposition and characterizati