Jobs / United States / Intel Corporation
Module Development Engineer - LTD Dry Etch
Intel Corporation · 🇺🇸 US, Oregon, Hillsboro
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles287 certified filings for “Process Engineer” (Materials Engineers) in OR: $113k–$133k, median $133k. Most were filed at wage level III (87%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: Business Group Intel Foundry Technology Development is committed to delivering world-class manufacturing solutions that power Intel's product roadmap. The team leads advancements in semiconductor process engineering, enabling innovative device architectures and high-volume production. Joining this team means contributing to Intel's pursuit of excellence and maintaining its leadership in a dynamic, competitive market. About the Role Join Intel Logic Technology Development and help advance the next generation of patterning. You will operate in a high impact space, partnering closely with cross functional teams (Process Integration, Manufacturing, Equipment Engineering, Yield/Defect Engineering, and suppliers) to solve complex technical challenges and establish long term systems that sustain performance. This role requires regular onsite presence to fulfill essential job responsibilities. • Drive technology development for future technology and high-volume manufacturing, provide process integration and equipment solutions, and perform feasibility studies to meet desired device specifications. • Own and drive development of the next generation patterning processes, including process architecture, optimization strategies, and qualification methodologies. • Perform pathfinding activities in support of process and hardware development on existing and first of kind equipment, enabling manufacturing of innovative device architectures and developing roadmaps for technologies enabling future roadmap. • Provide technical leadership for cross functional problem solving to resolve complex process and defect issues; drive structured root cause, containment, and permanent corrective actions. • Design and execute comprehensive characterization plans; plan and conduct experiments (DOE/response surface/robustness studies) across the development cycle. • Establish and mature control systems to optimize and sustain production performance (SPC, control plans, alarms, response plans, recipe governance, sustaining systems). • Develop strategies and infrastructure to resolve difficult problems and implement systems to manage these problems in the future (standard work, monitoring, dashboards/analytics, knowledge capture). • Drive improvements in yield, reliability, cost, productivity, and process capability, ensuring scalable transfer to manufacturing and ongoing sustainment. • Influence technical direction, mentor engineers (as appropriate for grade), and communicate status/risks clearly to stakeholders. • Recommend and implement modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. • Partner with key equipment and material suppliers to develop and implement enabling elements of the technology. Perform process technology feasibility studies through theoretical simulations and/or practical engineering methods. Core Competencies • Strong collaboration and problem-solving skills to work effectively in cross-disciplinary teams. • Ability to communicate technical data and concepts to both technical and non-technical audiences. Qualifications: The Minimum qualifications listed below are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience, academic projects, and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: • PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with