Jobs / United States / Intel Corporation
Module Engineering PhD Intern - Wet Etch
Intel Corporation · 🇺🇸 US, Oregon, Hillsboro
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles50 certified filings for “Engineering Manager” (Architectural and Engineering Managers) in OR: $182k–$209k, median $182k. Most were filed at wage level III (52%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: The Role and Impact Join Intel Foundry's cutting-edge manufacturing organization as a Module Engineering PhD Intern . In this role, you will contribute to the development, optimization, and sustainment of advanced semiconductor manufacturing processes within a specific process module. Working alongside experienced engineers, you will gain hands-on exposure to state-of-the-art semiconductor fabrication technologies while helping solve complex technical challenges that drive manufacturing excellence. As a Module Engineering Intern, you will support process and equipment improvements, analyze manufacturing performance, and collaborate across engineering disciplines to enhance process capability, yield, quality, and operational efficiency. Your work will directly contribute to Intel's next-generation semiconductor technologies and manufacturing innovations. About Intel Foundry Intel Foundry is a world-class semiconductor manufacturing organization that enables Intel's global technology leadership. Our teams develop, optimize , and sustain advanced manufacturing processes and equipment across some of the most sophisticated fabrication facilities in the world. By joining Intel Foundry, you will become part of a highly collaborative environment focused on innovation, technical excellence, and shaping the future of semiconductor technology. Key Responsibilities • Support the development, implementation, optimization, and sustainment of semiconductor manufacturing processes within a specific module area. • Troubleshoot, maintain , and qualify manufacturing equipment to ensure process stability, reliability, and performance. • Analyze process and equipment performance data to identify opportunities for improvement and drive corrective actions. • Collaborate with cross-functional engineering teams to improve process control methodologies, operational efficiency, yield, and quality. • Investigate and resolve process and equipment-related issues affecting manufacturing operations. • Apply scientific and engineering principles to solve complex technical challenges in a high-volume manufacturing environment. • Participate in hands-on projects aligned with Intel's business objectives while developing technical, analytical, and leadership skills. • Present technical findings, recommendations, and project outcomes to engineering stakeholders. Qualifications: Minimum Qualifications • Currently pursuing a PhD in Chemistry, Physics, Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related scientific or engineering discipline. • Demonstrated knowledge of semiconductor manufacturing, materials processing, device fabrication, or related technologies through academic research, coursework, laboratory work, or industry experience. • Experience applying scientific and engineering methodologies to solve technical problems. • Strong analytical, troubleshooting, and problem-solving skills. Preferred Qualifications • Cumulative GPA of 3. 0 or higher. • 3+ months of educational, research, laboratory, internship, or industry experience . • Experience with data analysis, statistical methods, modeling, simulation, automation, or visualization tools such as Python, MATLAB, SQL, JMP, R, or equivalent platforms. • Experience leveraging AI and Large Language Models (LLMs) in research, engineering, or productivity workflows, including tools such as Microsoft Copilot or Google Gemini. • Research, coursework, projects, publications, or internship experience related to semiconductor technology, advanced manufacturing, process development, materials science, device physics, or data analytics. •