Jobs / United States / Intel Corporation
Module Engineering PhD Intern
Intel Corporation · 🇺🇸 US, Oregon, Hillsboro
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles50 certified filings for “Engineering Manager” (Architectural and Engineering Managers) in OR: $182k–$209k, median $182k. Most were filed at wage level III (52%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: The Role and Impact As a Module Engineering PhD Intern , you will play a critical role in advancing Intel's semiconductor manufacturing technology. In this position, you will work on challenging, hands-on projects that support the development, implementation, optimization, and continuous improvement of manufacturing processes within a specific process module. You will collaborate with cross-functional engineering teams to investigate process and equipment issues, analyze complex data sets, qualify manufacturing equipment, and drive process enhancements that improve yield, quality, and operational efficiency. This internship provides an excellent opportunity to apply advanced research and technical expertise while making a meaningful impact on next-generation semiconductor technologies. Business Group The Intel Foundry organization is driving innovation in semiconductor manufacturing through the development, optimization, and sustainment of advanced process technologies and production methodologies. The team is committed to delivering technology leadership and operational excellence while enabling Intel's future manufacturing roadmap. As part of this organization, you will work alongside industry-leading engineers and researchers in a collaborative environment focused on shaping the future of semiconductor manufacturing. Key Responsibilities • Support the development, implementation, and optimization of semiconductor manufacturing processes within a specific process module. • Troubleshoot, sustain, and qualify manufacturing equipment to improve process stability, yield, and operational efficiency. • Collaborate with engineering teams to develop and enhance process control methodologies that support production and technology development goals. • Conduct experiments, analyze data, and identify opportunities for process improvements and innovation. • Participate in root cause investigations and implement corrective actions to address process and equipment challenges. • Apply advanced engineering and scientific principles to solve complex manufacturing problems. • Present technical findings, recommendations, and project results to engineering stakeholders. Qualifications: Minimum Qualifications • Must be actively pursuing a PhD degree in Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related STEM field. • 3+ months of educational, research, laboratory, internship, or industry experience. • Demonstrated hands-on experience through academic research, laboratory work, internships, coursework, or technical projects. • Basic understanding of semiconductor manufacturing processes, process integration, or advanced manufacturing methodologies. Preferred Qualifications • Experience with data analysis, statistical methods, and process optimization techniques. • Strong academic performance with a cumulative GPA of 3. 0 or higher preferred. • Proficiency in Machine Learning, Python, SQL, or other data analysis tools. • Experience conducting research or developing technical solutions within semiconductor manufacturing, process engineering, or related fields. • Strong analytical, problem-solving, and troubleshooting skills. • Ability to work effectively in a collaborative, cross-functional engineering environment. • Excellent communication skills with the ability to present technical findings and recommendations. We encourage candidates who are passionate about innovation, research, and technology development to apply. Join Intel and contribute to the advancement of cutting-edge semiconductor manufacturing while gaining valuable industry e