Jobs / United States / Hewlett Packard Enterprise Company
Sr Principal Thermal Engineer
Hewlett Packard Enterprise Company · 🇺🇸 Sunnyvale, California, United States of America
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 486 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 167 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Hewlett Packard Enterprise Company paid sponsored hires in similar roles59 certified filings for “Systems/Software Engineer III” (Software Developers) in CA: $149k–$206k, median $183k. Most were filed at wage level II (43%) — 2 lottery entries, ≈31% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Hewlett Packard Enterprise Company
The US Department of Labor certified 486 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 167 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Hewlett Packard Enterprise Company →
About the role
Sr Principal Thermal Engineer This role has been designed as ‘’Onsite’ with an expectation that you will primarily work from an HPE office. Who We Are: Hewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work. We help companies connect, protect, analyze, and act on their data and applications wherever they live, from edge to cloud, so they can turn insights into outcomes at the speed required to thrive in today’s complex world. Our culture thrives on finding new and better ways to accelerate what’s next. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good. If you are looking to stretch and grow your career our culture will embrace you. Open up opportunities with HPE. Job Description: HPE is seeking a Senior Principal Thermal Engineer who is a recognized authority in advanced liquid cooling for high-performance networking, compute, and data-center hardware. This role will define organization-wide thermal architectures, methodologies, and technology roadmaps for direct-to-chip cold-plate, manifold, coolant-distribution, immersion, hybrid air-liquid, and emerging two-phase cooling solutions. The engineer will lead complex thermal programs from concept through production, solve critical business and customer challenges, and deliver substantial, long-lasting impact through improved performance, reliability, time to market, cost, quality, and product differentiation. The successful candidate will influence executive and cross-functional decisions, guide development partners and suppliers, contribute to industry standards, mentor engineers, and strengthen HPE’s technical community. Responsibilities: • Establish and define organization-wide thermal architectures, design methodologies, specifications, and validation practices for liquid-cooled hardware across multiple platforms and organizations; contribute to long-range technology roadmaps. • Serve as the go-to technical leader for direct liquid cooling, including cold plates, manifolds, quick disconnects, hoses and piping, pumps, heat exchangers, coolant distribution units, facility-water interfaces, immersion systems, hybrid cooling, and emerging two-phase solutions. • Lead system-level thermal architecture, analysis, and design from concept and feasibility through qualification, NPI, manufacturing ramp, and sustaining engineering for high-power ASICs, optics, power components, and densely packed electronic modules. • Perform and direct thermal-fluid CFD modeling using FloTHERM, FloEFD, Macroflow, or equivalent tools; correlate models with test data and translate results into clear design decisions and margin improvements. • Define fluid, thermal, mechanical, reliability, serviceability, manufacturability, safety, and regulatory requirements, including flow and pressure budgets, pressure drop, temperature uniformity, material and coolant compatibility, corrosion control, leak prevention and detection, contamination control, and failure-response strategies. • Develop and oversee validation plans and empirical testing for component, subsystem, chassis, rack, and facility interfaces; guide engineers and technicians in instrumentation, test execution, data analysis, and root-cause investigations. • Review designs and project activities for compliance with technology, quality, reliability, and development standards; drive valuable recommendations and innovations into platform architectures. • Evaluate and select technologies, suppliers, outsourced development partners, and manufacturing processes; oversee technical deliverables and resolve complex cross-organizational issues. • Partner with mechanical, electri