Senior Hardware Technical Lead, Interconnect Systems

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About the role

NVIDIA’s Interconnect Product Hardware Engineering team designs the most advanced test solutions for high-speed electro-optical devices powering next-generation AI data centers. We are looking for a Hardware Technical Lead to own end-to-end technical program execution of complex Co-Packaged Optics (CPO) and Silicon Photonics (SiPho) interconnect hardware — from concept through mass production. This role sits at the intersection of hardware system engineering, electro-optical characterization, and cross-organizational program leadership. You will serve as the central focal point across multiple parallel engineering groups, driving alignment, resolving technical roadblocks, and ensuring on-time delivery of world-class products. This is a senior individual contributor role with a strong leadership dimension. The right candidate will bring both deep hands-on technical capability and program management skills to support complex multi-disciplinary efforts. What You’ll Be Doing:  • Drive the full program lifecycle of advanced CPO and interconnect test solutions — from requirements through architecture, design, bring-up, characterization, qualification, and release to HVM — while continuously evaluating new technologies and methodologies. • Act as the technical focal point across parallel workstreams including Board Design, Silicon Photonics, Opto-Mechanics, Thermal, FW/SW, DFT, Process Engineering, Manufacturing, and Quality — building integration plans and communicating status, priorities, risks, and dependencies to leadership. • Mentor engineers, conduct design reviews, and deliver constructive feedback to elevate team capabilities and foster a culture of engineering excellence; influence, lead, and align multi-site, multi-disciplinary teams toward common goals. • Consolidate requirements from internal stakeholders (Systems Engineering, Software, Marketing, Architecture, Production) into a comprehensive plan of record; coordinate resource allocation and team assignments in partnership with engineering management. • Define and execute the validation and coverage strategy from die to system level — develop characterization plans, test methodologies, automation frameworks, and data analysis pipelines to validate product performance across environmental conditions (temperature, voltage, process corners). • Perform hands-on electrical and optical debug, failure analysis, and failure segmentation using advanced lab equipment (oscilloscopes, spectrum analyzers, OPMs, BER testers, source meters); drive root-cause analysis of complex issues spanning electrical, optical, mechanical, thermal, and firmware domains. • Develop scripting and automation solutions (Python) for test automation, data collection, hardware control (I2C, SPI), and production process optimization; own electrical specifications, peripheral equipment selection, and DFM/DFT guidelines. • Partner with manufacturing and production engineering teams to build robust test solutions for mass production, improve yield and test coverage, and lead innovations that reduce test time and cost. What We Need to See:  • B.Sc. or M.Sc. in Electrical Engineering, Electro-Optics, Applied Physics, or a related field (or equivalent experience) • 12+ years in hardware system engineering, characterization, and/or product engineering for electro-optical or high-speed communication products • 5+ years serving as a technical lead across multi-disciplinary projects end-to-end • Demonstrated success in technical program management — guiding complex hardware programs from concept through mass production • Deep hands-on background in hardware design, lab bring-up, characterization, debug, and electrical specification review • Proficiency in Python scripting, data analysis (JMP or equivalent

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