Jobs / United States / Intel Corporation
Advanced Packaging Process Engineer
Intel Corporation · 🇺🇸 US, Arizona, Phoenix
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles69 certified filings for “Process Engineer” (Materials Engineers) in AZ: $105k–$124k, median $110k. Most were filed at wage level III (51%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: Intel is one of the world's most iconic technology companies, driving innovation in semiconductors for over five decades. From the chips that power your laptop to the processors enabling artificial intelligence and autonomous vehicles, Intel's technology is woven into the fabric of modern life. Our Advanced Packaging Technology Manufacturing (APTM) organization is at the heart of Intel's next chapter — developing and commercializing the packaging technologies that will define the future of computing. We are committed to building a diverse, inclusive, and innovative workplace where every employee can do their best work and make a real difference. We are looking for a talented and driven Packaging Module Development Engineer to join our APTM team at Intel's world-class manufacturing campus in Chandler, Arizona. In this role, you will be a key contributor to the development, optimization, and qualification of advanced semiconductor packaging processes — work that directly enables Intel's products to reach billions of people around the world. Whether you're a recent PhD graduate eager to apply your research expertise or an experienced engineer ready to take on new challenges, this is an opportunity to do meaningful, high-impact work alongside some of the best engineers in the semiconductor industry. Key Responsibilities: • Develop and optimize packaging assembly processes and equipment to meet stringent quality, reliability, yield, and cost targets in high-volume manufacturing environments. • Design and execute experiments using Statistical Process Control (SPC) and Design of Experiments (DOE) to characterize processes and drive continuous improvement. • Innovate new techniques, materials, and tools to address emerging challenges in semiconductor packaging performance and reliability. • Collaborate with cross-functional teams across engineering, manufacturing, and product development to identify technical risks and ensure successful product launches. • Establish specifications for materials and equipment, ensuring adherence to Intel's quality and operational standards. • Document and communicate technical findings, process improvements, and experimental results through reports, white papers, and qualification documents. • Lead standardization efforts for manufacturing systems, equipment setups, and process flows across Intel's global sites. As a Successful Candidate, You Will Bring: • Intellectual curiosity — a genuine passion for understanding how things work and a drive to continuously learn and improve. • Collaborative spirit — the willingness to work effectively with diverse, cross-functional teams and build strong working relationships. • Resilience and adaptability — comfort navigating ambiguity and the skills to pivot quickly when challenges arise. • Clear communication — the skills to translate complex technical findings into clear, actionable insights for a variety of audiences. • Ownership mindset — a proactive approach to taking responsibility for outcomes and driving projects to completion. • Creative problem-solving — the skills to think outside the box and develop innovative solutions to complex engineering challenges. Are you ready to take the next step in your career and be part of a team that is shaping the future of technology? Apply today and join Intel's Oregon team, where your expertise and passion will directly influence the world's most advanced semiconductor manufacturing processes. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained thr