Jobs / United States / Intel Corporation
WATD Module Development Engineer
Intel Corporation · 🇺🇸 US, Oregon, Hillsboro
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles287 certified filings for “Process Engineer” (Materials Engineers) in OR: $113k–$133k, median $133k. Most were filed at wage level III (87%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: Intel Corporation is one of the world's leading semiconductor companies, dedicated to designing and manufacturing innovative technology that powers the devices and infrastructure shaping modern life. With a legacy of breakthrough innovation spanning decades, Intel continues to push the boundaries of what's possible — from advanced chip manufacturing to next-generation packaging technologies. At Intel, we believe in the power of human ingenuity, and we're committed to creating an inclusive, collaborative environment where the brightest minds come together to change the world. We are looking for a talented and driven Module Development Engineer to join Intel's Wafer Assembly Technology Development (WATD) group in Oregon. In this high-impact role, you will be at the forefront of advancing Intel's semiconductor manufacturing capabilities, driving the design, development, and optimization of complex processes and equipment. Your work will directly influence Intel's technology roadmap, manufacturing efficiency, and product quality — helping Intel maintain its leadership position in global semiconductor innovation. This is a unique opportunity to work alongside industry experts, collaborate with world-class suppliers, and contribute to technologies that will define the future of computing. Key Responsibilities: • Lead the design and development of advanced manufacturing processes and equipment solutions for next-generation semiconductor products • Conduct feasibility studies using theoretical simulations and practical engineering methods to meet device specifications • Optimize process integration through material selection, equipment metrology, and parameter settings for new product designs • Perform pathfinding activities to develop processes and hardware for innovative device architectures • Develop and implement technology roadmaps that support future manufacturing needs • Recommend and implement modifications to equipment and manufacturing techniques to improve efficiency, reliability, and output • Collaborate with equipment suppliers and materials vendors to develop enabling technologies for advanced manufacturing solutions • Design and execute experiments using statistical methodologies (DOE, SPC) to optimize process windows and control strategies • Stay current with industry trends, emerging technologies, and process innovations, contributing to Intel's competitive edge As a Successful Candidate, You Will Bring: • Communicates complex technical concepts clearly and confidently to diverse audiences • Thrives in a collaborative, cross-functional team environment • Approaches challenges with curiosity, creativity, and a solutions-oriented mindset • Demonstrates strong attention to detail and a commitment to quality • Adapts quickly to evolving priorities and ambiguous problem spaces • Takes ownership of your work and drives initiatives through to completion • Builds strong relationships with internal teams, vendors, and industry partners • Leads with integrity, humility, and a passion for continuous learning If you're passionate about pushing the boundaries of semiconductor technology and want to be part of a team that's shaping the future of computing, we want to hear from you. Apply today and take the next step in your career at Intel — where your ideas, expertise, and ambition can truly change the world. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. This Position is not eligible for Intel immigration sponsorship. Minimum Qualifications: • Bachelor’s degree in mechanical engi