Jobs / United States / Robert Bosch LLC
Overall Integration Engineer for 300 mm - BEOL technology (f/m/div.)
Robert Bosch LLC · 🇺🇸 Dresden, SN, DE
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 92 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 50 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Robert Bosch LLC paid sponsored hires in similar roles1 certified filing for “Sr Systems Integration Engineer” (Computer and Information Research Scientists) in MI: $138k–$138k, median $138k. Most were filed at wage level II (100%) — 2 lottery entries, ≈31% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Robert Bosch LLC
The US Department of Labor certified 92 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 50 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Robert Bosch LLC →
About the role
To strengthen our leading market position within the sensor products we will extend our MEMS and ASIC BEOL technology to 300 mm wafer. We are looking for a curious and technology-driven engineer (f/m/div.), who has a passion for technology and process. If you enjoy connecting the dots between different technologies, challenging technical boundaries, and turning complexity into manufacturable solutions, this role is for you. • As a Development and Integration Engineer, you will drive and control innovative technology developments for complex products with a focus on integration, including scheduling and the customer interface • Part of your responsibilities is implementing development goals together with a team of integrators and experts; you will achieve these goals by combining your technology know-how and manufacturing expertise with intensive, collaborative work and a high degree of personal responsibility and independence • Furthermore, you will develop semiconductor processes for the manufacturing of our sensor products • Driven by your passion for innovation, you will enable new technologies and materials and perform both technical and economic evaluation of the feasibility of new processes • You will coordinate internal interfaces across development sections and manufacturing to develop solutions and control their implementation from the start of development until they are ready for series production • With a focus on quality, you will manage quality assessments and process releases to ensure our high standards are met • In addition, you will be responsible for the cooperation with research institutes for basic development, driving foundational progress in our field • Personality : Self-initiated, assertive, creative, strong team player, goal-oriented • Working Practice: Systematic, proactive, resilient • Experience and Know-How : Multiple years of relevant professional experience as project lead; very good knowledge in sensor, micromechanics and semiconductor technology required; knowledge of relevant analytical methods beneficial; excellent understanding of physical principles and interrelationships; ability to guide an interdisciplinary team of experts in technical matters • Language: Very good knowledge of English, proficient German • Education: Completed university studies (Master/Diploma/PhD) in engineering or natural sciences, physics, chemistry, material sciences or a comparable qualification We offer flexible working models: from various part-time options to mobile working and job sharing. Feel free to contact us. Diversity and inclusion are not just trends for us but are firmly anchored in our corporate culture. Therefore, we welcome all applications, regardless of gender, age, disability, religion, ethnic origin or sexual identity. Need support during your application? Samuel Zinn (Human Resources) +49 7121 35-33717 Need further information about the job? Christina Leinenbach (Functional Department) +49 712135-33480 Data Privacy Information By submitting your application, you acknowledge that your application documents and personal data may be accessed and reviewed by hiring managers and authorized recruitment representatives of both Bosch Sensortec GmbH and Robert Bosch GmbH where necessary for the recruitment process and the assessment of your suitability for the position. Access is limited to individuals involved in the recruitment process and is subject to applicable data protection laws. For further information on the processing of your personal data, please refer to the Bosch Applicant Privacy Notice .