Jobs / United States / Intel Corporation
Photonic System Design Engineer
Intel Corporation · 🇺🇸 US, California, Santa Clara
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles211 certified filings for “Component Design Engineer” (Electronics Engineers, Except Computer) in CA: $125k–$167k, median $142k. Most were filed at wage level III (43%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful. Responsibilities: • Defines and drives photonics components development and understands and influences the architecture of photonics integrated circuits. • Architects, designs, simulates, and develops photonics components such as lasers, semiconductor optical amplifiers, passives, highspeed detectors, and modulators, and/or IIIV solutions on silicon platform. • Performs tolerance analysis and optimizes components for performance, power, area, and reliability. • Drives overall test chip execution and coordination including chip design, layout, tapeout, test, and validation. • Analyzes test data from characterizations, identifies performance gaps, and drives improvement paths. • Develops and implements photonics components and system modeling methodologies and proposes and implements new test methodologies. • Conducts research in novel photonics components and technologies, defines next generation components architectures, and initiates and drives IP development programs. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your degree, research and or relevant previous job and or internship experiences. Minimum Qualifications: Master's degree in Electrical Engineering, Physics, or a similar discipline with focus on Silicon Photonics, optical component, module, and transmission system with 6+ years of industry experience listed below OR a PhD in Electrical Engineering, Physics, or a similar discipline with focus on Silicon Photonics, optical component, module, and transmission system with 4+ years of industry experience listed below. • Experience in system link modeling and design methodology and tools for high speed (50GBaud to 200GBaud) optical communication transceivers and CPO/OCI engine products, both experimental/theoretical performance analysis, and optical components and system optimizations. • Experience in architecting, designing and defining new systems and components for high-speed silicon photonics commercial optical communication products. • Experience with modeling both direct detect higher order modulation format systems, advanced modulation formats, noncoherent and coherent optical systems (ie, modulators, detectors, lasers). • Experience with optical/electrical simulation platforms Simulink, Matlab, ADS, Lumerical, HFSS, VPI, etc. Preferred Qualifications: • Experience modeling in transmitter, receiver, analog and Serdes interactions, Si and III-V photonic devices, subsystems in high-speed optical communication systems. • Experience with co-simulating high-speed electronics with optical components, DSP modeling, coding/decoding techniques, OSNR/BER/FEC error correction, CMOS IC's (driver, TIA's), and advanced modulation formats. • Experience in designing high speed optoelectronic and electronic components. • Experience in component, carrier, RF package, driver-modulator optimization, high-speed i