Jobs / United States / Intel Corporation
Technology Development Foundry Engineering – Staff Engineer
Intel Corporation · 🇺🇸 5 Locations
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles11 certified filings for “SoC Design Engineer” (Architectural and Engineering Managers) in TX: $160k–$224k, median $192k. Most were filed at wage level II (36%) — 2 lottery entries, ≈31% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: As the world's largest chip manufacturer and a global leader in innovation and advanced technology, Intel strives to make every aspect of semiconductor manufacturing state of the art, from process development and manufacturing to yield improvement, packaging, final test, optimization, and world-class supply chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth. We are constantly working to create a more connected and intelligent future, and we need your help. Change tomorrow. Start today. What We Offer : We foster a collaborative, supportive, and exciting environment where some of the brightest minds in the world come together to achieve exceptional results. We provide opportunities to transform technology and create a better future by delivering products that impact the lives of people around the globe. Life at Intel: https://jobs.intel.com/en/life-at-intel What We Do : Join the Logic Technology Development (LTD) organization, a powerhouse of process technology innovation driving Intel's IDM 2.0 strategy and enabling the success of our global foundry customers. We are seeking a versatile Staff Engineer to be at the forefront of Intel's foundry transformation, serving as a pivotal technical partner who guides customers through the entire product development lifecycle. In this role, you will leverage multidisciplinary expertise spanning product/process integration, device engineering, and yield engineering to lead customers from pre-silicon evaluation and design tape-out through testing, validation, silicon qualification, and production ramp.This is a unique opportunity to apply broad technical leadership, solve complex challenges, face customers, and actively shape the future of the semiconductor industry in the AI era. What You Will Do : We are seeking candidates with broad semiconductor expertise across foundry technology development. Depending on experience and business needs, responsibilities may include the following areas: Product/Process Integration • Drive end-to-end Multi-Project Wafer (MPW) and New Product Introduction (NPI) execution across the full manufacturing flow, from front-end processing through far backend operations, ensuring quality and on-time delivery. • Serve as the primary customer-facing interface for silicon execution including wafer status, silicon health, technical issues, process changes, and execution alignment. • Own identification and resolution of customer-specific integration challenges. • Drive enablement of customer-specific requirements through effective cross-functional coordination. Device Engineering • Serve as the primary customer interface for device performance, including manufacturing readiness reviews, performance roadmaps and projections, post-silicon characterization, model to hardware correlation, and resolution of customer-specific device issues. • Track device performance targets and process control capability while assessing alignment between silicon results and PDK expectations. • Drive device performance optimization through silicon learning, root-cause analysis, and cross-functional corrective actions to improve product readiness and close performance gaps. Yield Engineering • Serve as the primary yield point of contact throughout the product lifecycle, from design tape-out through High Volume Manufacturing (HVM). • Develop predictive yield models to identify parametric and defect-related loss mechanisms and provide yield projections for test chips, shuttle vehicles, and production product