Jobs / United States / Samsung Semiconductor INC
Senior Staff Engineer, Thermal Simulation
Samsung Semiconductor INC · 🇺🇸 San Jose, California, United States
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 123 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 52 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Samsung Semiconductor INC paid sponsored hires in similar roles1 certified filing for “Staff Engineer, Mechanical Simulation” (Mechanical Engineers) in CA: $159k–$159k, median $159k. Most were filed at wage level III (100%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Samsung Semiconductor INC
The US Department of Labor certified 123 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 52 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Samsung Semiconductor INC →
About the role
Please Note: To provide the best candidate experience amidst our high application volumes, each candidate is limited to 10 applications across all open jobs within a 6-month period. Advancing the World’s Technology Together Our technology solutions power the tools you use every day--including smartphones, electric vehicles, hyperscale data centers, IoT devices, and so much more. Here, you’ll have an opportunity to be part of a global leader whose innovative designs are pushing the boundaries of what’s possible and powering the future. We believe innovation and growth are driven by an inclusive culture and a diverse workforce. We’re dedicated to empowering people to be their true selves. Together, we’re building a better tomorrow for our employees, customers, partners, and communities. We are seeking a highly experience hands-on Senior Staff Thermal Engineer to lead thermal modeling, analysis, and solution development for semiconductors and advanced packaging technologies. The ideal candidate will have a strong technical background in semiconductor packaging, advanced packaging, electronics cooling, or a related field, with demonstrated expertise in thermal simulation and analysis. This role will work closely with Samsung customers and internal engineering customers and internal engineering teams to develop and optimize thermal solutions from early product through detailed modeling and design validation. The successful candidate will collaborate extensively with cross functional and cross-cultural teams. Location: Daily onsite presence at our San Jose headquarters in alignment with our Flexible Work policy with 10-20% of domestic and international travel. Reports to: Thermal/Mechanical Simulation Manager What You’ll Do • Lead and perform hands-on thermal modeling and analysis for semiconductor packages, advanced packaging, and electronic systems. • Build and analyze detailed models using ANSYS Icepak and Siemens Flotherm, including model setup, boundary conditions, solver execution and post-processing. • Influence the architecture and/or design, materials selection, and structural integrity of the high-performance advanced packaging, and other associated components and collaterals under manufacturing, test, and usage conditions. • Analyze simulation and measurement results to enhance product reliability. • Support Samsung customers throughout the product development cycle, from early thermal architecture and feasibility studies to detailed modeling, optimizations, and design recommendations. • Translate customer requirements and thermal specifications into simulation methodologies. • Develop best known standards and methodologies and create innovative solutions for challenging semiconductor and packaging applications. • Communicate technical findings clearly through engineering reports, presentations and customer reviews. • Stay current with emerging technologies in advanced packaging, HBM, 2.5D/3D integrations, high power computing, and electronics cooling. What You Bring • PhD in Mechanical Engineering, Thermal/Fluids, or related Physical Science with 10+ years of Industry Experience is preferred. • Experience in the use of CFD tools such as ANSYS Icepak, Flotherm, CELSIUS and analyzing, debugging, and proposing solutions to resolve various electronic packaging issues observed during assembly, reliability and operation. Ability to independently build models, perform analysis, troubleshoot results and develop engineering recommendations. • Strong understanding of heat transfer, fluid mechanics, thermal management, and electronics cooling fundamentals. • Fundamental understanding of IC chip/package architectures and thermal design constraints. • Working experience in SiP (System in Package) thermal analysis