Jobs / United States / Samsung Semiconductor INC
Staff Engineer, SSD Storage and Systems Architecture
Samsung Semiconductor INC · 🇺🇸 San Jose, California, United States
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 123 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 52 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Samsung Semiconductor INC paid sponsored hires in similar roles45 certified filings for “Staff Engineer” (Electronics Engineers, Except Computer) in CA: $157k–$186k, median $169k. Most were filed at wage level III (43%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
Or apply yourself on the official page →
Sponsor Radar — Samsung Semiconductor INC
The US Department of Labor certified 123 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 52 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Samsung Semiconductor INC →
About the role
Please Note: To provide the best candidate experience amidst our high application volumes, each candidate is limited to 10 applications across all open jobs within a 6-month period. Advancing the World’s Technology Together Our technology solutions power the tools you use every day--including smartphones, electric vehicles, hyperscale data centers, IoT devices, and so much more. Here, you’ll have an opportunity to be part of a global leader whose innovative designs are pushing the boundaries of what’s possible and powering the future. We believe innovation and growth are driven by an inclusive culture and a diverse workforce. We’re dedicated to empowering people to be their true selves. Together, we’re building a better tomorrow for our employees, customers, partners, and communities. Samsung Semiconductor is seeking an industry-leading SSD Storage and System Architect with recognized technical influence to design and define our next-generation Enterprise, Datacenter (DC), and AI-optimized storage architectures. As AI/ML workloads explode, storage has become the primary bottleneck for data ingestion, checkpointing, and GPU utilization. This role focuses on the end-to-end design of high-performance storage systems, optimization of flash translation layers (FTL), and hardware-software co-design engineered specifically to accelerate AI training and inference. You will leverage your deep domain expertise to align system architecture with major hyperscale cloud vendor AI clusters while directly bridging the gap with Samsung's internal R&D teams to maximize the competitive edge, silicon efficiency, and performance synergy of Samsung's cutting-edge memory, CXL, and controller solutions. Location: Daily onsite presence at our San Jose headquarters in alignment with our Flexible Work policy with 10% of domestic travel. Reports to: Principal Engineer, R&D Product Development Planning What You’ll Do • AI-Optimized Architecture Design: Define and model enterprise/DC SSD architectures optimized for massive parallel read paths required by AI data loaders (e.g., PyTorch, TensorFlow) and high-burst write paths for AI model checkpointing. • Samsung Product Integration: Translate complex hardware, CXL, and controller constraints into optimized firmware architectures for Samsung’s enterprise SSD controller, FTL, and NAND flash subsystems. • Cloud Infrastructure Alignment: Architect features tailored for hyperscaler AI infrastructure, matching specifications like Microsoft’s Azure AI Cloud storage architectures and Meta’s next-generation GPU-accelerated storage platforms. • HW/FW Co-Design: Collaborate closely with ASIC design, firmware development, and validation teams to resolve cross-domain architectural bottlenecks in ultra-low latency environments. • Technology Prototyping: Develop architectural simulators or FPGA prototypes to evaluate next-generation storage features, AI caching algorithms, and host-managed storage paradigms. • Industry Influence & Innovation: Leverage an established technical network to align emerging system architectures with broader storage industry trends, open-source AI ecosystems, and storage standards (NVMe, OCP, SNIA). • Strategic IP Creation: Drive the creation of foundational architectural patents in the domains of AI storage optimization and near-data processing to protect Samsung's system-level intellectual property. • Hyperscale AI Engagement: Jointly architect next-generation AI datacenter deployment models (e.g., custom pooling, disaggregated storage, GPUDirect Storage [GDS] integrations, and Ethernet-attached SSDs) directly with lead architects from AWS, Google Cloud, Microsoft, and Meta. • Advanced Feature Pioneering: Lead the architectural definition of advanced storage paradigms such as FDP