Jobs / United States / Astera Labs INC
Manager, Package Design Engineering
Astera Labs INC · 🇺🇸 San Jose, California, United States
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 63 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 10 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Astera Labs INC paid sponsored hires in similar roles14 certified filings for “Tech Lead Design Verification Engineer” (Electrical Engineers) in CA: $160k–$218k, median $206k. Most were filed at wage level IV (70%) — 4 lottery entries, ≈61% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
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Sponsor Radar — Astera Labs INC
The US Department of Labor certified 63 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 10 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Astera Labs INC →
About the role
Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com . Role Overview Astera Labs is seeking a Manager, Package Design Engineering to lead and scale our Package Design team in San Jose. In this high-impact role, you'll own the end-to-end delivery of advanced IC packaging solutions—from early architecture definition through production ramp—enabling the next generation of AI infrastructure and connectivity products. As the semiconductor industry races toward chiplet-based architectures, 2.5D/3D integration, and ever-increasing bandwidth demands, packaging has become a critical differentiator. You'll build and mentor a high-performing team while driving cross-functional execution with silicon architecture, SIPI, PCB, validation, manufacturing, and external partners including substrate vendors and OSATs. Your work will directly impact Astera Labs' ability to deliver industry-leading PCIe, CXL, and Ethernet connectivity solutions to the world's most demanding hyperscale and AI customers. This role offers the opportunity to shape design methodology, establish scalable standards, and enable chip-package-board co-design frameworks across multiple product lines in a fast-moving, innovation-driven environment. Key Responsibilities • Team Leadership & Execution • Build, mentor, and scale a high-performing package design engineering team with clear ownership, accountability, and execution flows • Establish design templates, standards, and best-known methods (BKMs) across multiple concurrent programs • Lead design reviews, audits, and issue resolution through bring-up and production ramp • Package Design Delivery • Own end-to-end package design execution including FCBGA/FCCSP, monolithic, multi-die, and chiplet-based designs from concept feasibility through tape-out and production • Define and review substrate stack-ups, pad stacks, routing strategies, and design constraints to meet electrical, thermal, mechanical, and manufacturability requirements • Drive technical tradeoffs across performance, cost, yield, and schedule, ensuring high-quality design closure and on-time delivery • Cross-Functional Collaboration • Partner with SIPI, silicon architecture, system/board design, and product teams to drive chip-package-board co-design and resolve system-level challenges • Collaborate with OSATs and substrate vendors to ensure design feasibility, manufacturability, and alignment with evolving design rules and technology roadmaps • Support adoption of advanced packaging technologies such as 2.5D, chiplet, CPO/CPC, and heterogeneous integration platforms • Methodology & Automation • Develop and scale design methodologies and automation flows to improve efficiency, quality, and repeatability across the organization Basic Qualifications • Bachelor's degree in Electrical Engineering, Materials Science, or related field • 10+ years of progressive experience in IC package design using tools such as Cadence Allegro APD/SiP • 5+ years of leadership experience managing teams or technical organizations in IC packaging environme