Jobs / United States / Renesas Electronics America INC
Senior Manager, Product Engineering
Renesas Electronics America INC · 🇺🇸 Austin, TEXAS, US
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 56 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 18 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Renesas Electronics America INC paid sponsored hires in similar roles4 certified filings for “Sr. Staff Project/Program Manager” (Architectural and Engineering Managers) in TX: $193k–$227k, median $193k. Most were filed at wage level III (50%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
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Sponsor Radar — Renesas Electronics America INC
The US Department of Labor certified 56 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 18 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Renesas Electronics America INC →
About the role
Role Overview & Strategic Impact As the leader of our Module Product Engineering function, you will own the end-to-end technical execution, workforce planning, and operational governance for advanced multi-chip power modules. You will bridge senior executive strategy with hands-on engineering excellence—partnering closely with Design, Test, Quality, Manufacturing, Supply Chain, and OSAT partners to ensure high-yield, high-reliability delivery at scale. Key Responsibilities Strategic Team Leadership & Capability Building • Direct & Scale the Org: Own workforce planning, hiring, onboarding, skill development, and succession planning for a high-performing team of Product Engineers and Embedded PE Leads. • Standards & Governance: Define and maintain global module PE standards for readiness, characterization, yield analysis, qualification, and product change management. • Executive Representation: Represent the Module PE organization in NPI gate reviews, executive escalation forums, customer discussions, and strategic capacity planning. NPI to High-Volume Manufacturing Ownership • Manufacturing & Yield Optimization: Oversee robust module manufacturability across internal and OSAT manufacturing sites, driving data-driven improvements in yield, cycle time, cost, and defect prevention (assembly workmanship, die attach, clip attach, and solder integrity). • Governance & Escalations: Drive decision-making for quality, yield excursions, production holds, qualification strategy, and customer-facing corrective actions. Cross-Functional Alignment • Partner across Design, Test, Quality, Operations, Supply Chain, and Product Management to translate roadmap goals into actionable tooling, data, and staffing requirements. Experience & Skills: • Experience: 10+ years of semiconductor product engineering, manufacturing engineering, or test/quality leadership, including 5+ years managing technical engineering teams . • Domain Depth: Proven technical expertise in semiconductor power products, advanced power modules, packaging/assembly processes, qualification, and high-volume manufacturing (HVM). • Operational Leadership: Demonstrated track record of establishing operating metrics, yield governance, and execution standards across complex engineering workstreams. • Cross-Functional Influence: Exceptional ability to lead cross-functional alignment across internal sites, OSAT partners, and executive stakeholders. • Communication: Clear, concise executive communication skills with the ability to summarize complex technical risks, trade-offs, and strategic recommendations. • Education: Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Engineering, or related technical field (Master’s degree in Engineering or Business preferred). Why Join Renesas? • Drive High-Growth AI Tech: Lead the team building power delivery solutions for next-generation AI computing clusters. • Comprehensive Total Rewards: Enjoy a competitive base salary, annual performance bonus, RSU equity grants, top-tier health and retirement benefits, and much more. • Relocation Support: Moving to Austin? We offer relocation assistance for qualified candidates. • Flexible Hybrid Model: A balanced work environment giving you the power of on-site collaboration with the flexibility of hybrid remote work. Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global,