Jobs / United States / Renesas Electronics America INC
Principal Package Design Engineer
Renesas Electronics America INC · 🇺🇸 San Jose, CALIFORNIA, US
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 56 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 18 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Renesas Electronics America INC paid sponsored hires in similar roles4 certified filings for “Staff System Engineer” (Electronics Engineers, Except Computer) in CA: $162k–$187k, median $168k. Most were filed at wage level II (100%) — 2 lottery entries, ≈31% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
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Sponsor Radar — Renesas Electronics America INC
The US Department of Labor certified 56 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 18 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Renesas Electronics America INC →
About the role
Principal Package Design Engineer Location: Hybrid at main Renesas Electronics America locations (San Jose, CA / Austin, TX) Department: Semiconductor Power Product Group Reports To: Senior Principal, Device Design Packaging Technology, Strategy, Operations Position Summary We are seeking a Principal Package Design Engineer to lead the development and integration of next-generation packaging solutions for high-performance semiconductors and electronic products. This role will focus on advanced package architecture, assembly processes, thermal and mechanical reliability, and cross-functional collaboration with design, applications, product engineering, manufacturing, suppliers, and quality teams. The ideal candidate has deep expertise in semiconductor packaging technologies and a strong track record of bringing complex products from concept through qualification and high-volume production. Key Responsibilities • Lead Advanced Packaging Initiatives: Lead the design, development, and qualification of advanced semiconductor packaging solutions, including: • Flip-chip, Chip Embedding • Wafer-level packaging (WLP/FOWLP) • Panel-level packaging (laminate, molding) • 2.5D/3D packaging • System-in-package (SiP) • Ball grid array (BGA/CSP) • Wafer-to-wafer and die-to-wafer heterogeneous bonding • Architecture & Simulation: Define package architecture based on electrical, thermal, mechanical, reliability, and cost requirements with hands-on, deep simulation expertise. • OSAT & Vendor Strategy: Drive package technology and OSAT selection and development for new product introductions (NPI). • Cross-Functional Collaboration: Work closely with IC design, product definers, substrate, board, thermal, reliability, applications, and manufacturing teams to ensure package compatibility and performance. • Layout & Stack-Up: Oversee package layout reviews, stack-up definition, material selection, and interconnect strategy. • Simulations & Modeling: Perform and guide others on simulations and analysis related to: • Signal integrity / power integrity • Thermal performance • Mechanical stress / warpage • Design for manufacturability (DFM) • Assembly & Qualification: Develop assembly flows and process requirements for OSATs and manufacturing partners. Lead package qualification activities, including DOE planning, failure analysis, and reliability testing. • Yield & Issue Resolution: Resolve packaging-related issues and challenges during NPI prototype builds, qualification, and production ramp. Collaborate with suppliers and internal/external manufacturing partners on process improvements, material evaluation, and yield optimization. • Documentation & Leadership: Create and maintain package specifications, design rules, process documentation, and technical reports. Mentor junior engineers and provide technical leadership across packaging initiatives. Required Qualifications • Education: MSc or PhD degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related field. • Experience: 5+ years of experience in advanced semiconductor packaging or advanced electronics packaging and system integration. • Technical Depth: Strong hands-on knowledge of advanced packaging technologies, materials, assembly processes, and application system integration as they apply to AI infrastructure and data center power management. • Reliability & Tools: Deep understanding of thermal, mechanical, and electrical interactions in package design and extensive, hands-on model setup, simulations, and analysis. Strong background in CAD and simulation tools. Experience with package reliability testing and qualification standards. • Supply Chain: Experience working with OSATs, substrate vendors, assembly houses, and se