Jobs / United States / Figure AI INC
Firmware Integration Engineer, Asia
Figure AI INC · 🇺🇸 Asia
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 22 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Figure AI INC paid sponsored hires in similar roles6 certified filings for “ELECTRICAL ENGINEER” (Electrical Engineers) in CA: $180k–$240k, median $205k. Most were filed at wage level IV (50%) — 4 lottery entries, ≈61% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Figure AI INC
The US Department of Labor certified 22 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Figure AI INC →
About the role
Figure is an AI robotics company developing autonomous general-purpose humanoid robots. The goal of the company is to ship humanoid robots with human level intelligence. Its robots are engineered to perform a variety of tasks in the home and commercial markets. Figure is headquartered in San Jose, CA. Operating under a Joint Development Manufacturing (JDM) model, Figure collaborates deeply with our manufacturing partners to co-develop next-generation hardware. As a Firmware Integration Engineer based in Asia, you are the forward-deployed technical anchor bridging our core US R&D engineering teams and these JDM partners. You will own the software that validates and brings our robotic hardware to life on the assembly line. Working on the ground at our partner facilities across China, Taiwan, and Vietnam, you will lead board bring-up for early prototypes, write diagnostic firmware to validate complex electro-mechanical assemblies, and ensure that our hardware transitions smoothly from the lab to mass production. We are looking for a highly autonomous, hands-on engineer who thrives in the fast-paced, collaborative, and high-stakes environment of hardware builds (EVT/DVT/PVT) and can seamlessly debug complex issues directly on the factory floor. Responsibilities: • Onsite NPI & Board Bring-Up: Lead early hardware bring-up directly at JDM partner sites, acting as the first line of defense for validating new custom PCBAs and robotic sub-assemblies. • Diagnostic Firmware: Write robust C/C++ diagnostic and test firmware to verify the functionality of microcontrollers, communication buses, power systems, and sensors during the manufacturing process. • Factory Test Integration: Partner with Hardware and Test Engineering to design, deploy, troubleshoot, and maintain automated Functional Test (FCT) fixtures for the assembly line. • System Debugging: Root-cause complex, system-level manufacturing defects on the factory floor in real-time using logic analyzers, oscilloscopes, and custom debug tooling. • Cross-Functional Liaison: Serve as the critical, real-time technical link between Figure's US-based hardware/firmware teams and the engineering staff at our JDM partners. Requirements: • Location & Travel: Must be based in China (or willing to relocate) with the ability to travel frequently to other manufacturing hubs in Asia, including Taiwan and Vietnam. • Education: BS or MS in Electrical Engineering, Computer Engineering, Computer Science, or the equivalent in experience. • C/C++ Proficiency: Strong ability to write clean, optimized C/C++ for embedded, resource-constrained systems. • Hardware Literacy: Excellent ability to read and interpret electrical schematics, PCB layouts, and component datasheets to debug hardware issues on the fly. • Manufacturing Experience: Hands-on experience working directly on the factory floor with Joint Development Manufacturers (JDMs), Contract Manufacturers (CMs), or Original Design Manufacturers (ODMs) during New Product Introduction (NPI). • Communication Protocols: Hands-on experience debugging embedded communication buses like CAN, I2C, SPI, and UART. Bonus Qualifications: • Language: Professional working proficiency in Mandarin Chinese is highly desirable to communicate effectively with local JDM engineering teams. • NPI Track Record: Proven experience taking complex consumer electronics, robotics, or automotive hardware from initial prototype through EVT/DVT/PVT to mass production. • Test Automation: Proficiency in Python for developing manufacturing test scripts, data parsers, and automated test-fixture infrastructure. • Robotics Architecture: Familiarity with the distributed systems, sensors (IMUs, absolute encoders, force-torque), and power requirements typical of advanced robotics.