Jobs / United States / Sk Hynix America INC
Director, System in Package Architecture
Sk Hynix America INC · 🇺🇸 San Jose, CA
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 6 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 2 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Sk Hynix America INC paid sponsored hires in similar roles1 certified filing for “AI/HPC System Engineer” (Software Developers) in CA: $187k–$187k, median $187k. The pay stated here ($10,000 per year) is below what this employer usually pays sponsored hires for this role. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Sk Hynix America INC
The US Department of Labor certified 6 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 2 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Sk Hynix America INC →
About the role
About SK hynix America: At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything from advanced mobile technology to massive AI data centers. With major investments in the U.S. and a leading position in the global AI revolution, we build the critical infrastructure of the digital landscape and remain committed to sustainable operations. We invite innovative minds to be part of our journey. Here, you will be part of a collaborative team pioneering the next generation of memory technologies, expanding our market footprint, and defining the future of computing. Work Model: Onsite Responsibilities: • Lead the end-to-end development of advanced packaging system architectures to maximize System in Package (SiP) performance, with a specific focus on High Bandwidth Memory (HBM). • Drive mechanical and electrical test vehicle design and development when necessary. • Spearhead research and development of novel technologies to enhance SiP performance, driving the roadmap for SOC and HBM integration in 2.5D and 3D packaging environments. • Lead strategic collaborations with internal teams and external partners to ensure seamless technology development and time-to-market. Minimum Qualifications: • BS in Electrical Engineering or equivalent combination of education and progressive industry experience. • 7+ years of specialized experience in advanced packaging architecture definition, strategy, and development. • Demonstrated success in driving cross-functional alignment across engineering, product, and operations teams to deliver complex solutions. • Proven track record of leading, mentoring, and scaling high-performing engineering teams, with experience managing managers or team leads preferred. • Exceptional verbal and written communication skills, with the ability to articulate technical strategies. Preferred Qualifications: • Master’s degree or PhD in Electrical Engineering, Materials Science, or related field. • 10+ years of experience in advanced packaging architecture, specifically with 2.5D and 3D packaging technologies. • Expert working knowledge of 2.5D/3D packaging technologies and large body substrate technologies. • Strong proficiency in Signal Integrity (SI) and Power Integrity (PI) analysis and optimization. • Direct experience in High Bandwidth Memory (HBM) architecture and integration is highly desirable. Benefits: • Top Tier health insurance at no employee cost • Paid day offs: Paid Time Off, Company Holidays, Parental Leave, Happy Fridays • 401k Matching • Flexible Spending Account (FSA) for Health Care & Dependent Care • Educational reimbursement up to $10,000 per year • Donation Matching and volunteering opportunities • Corporate discount programs • Free Breakfast/Lunch/Dinner provided to employees Compensation: Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. Pay within the provided range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process. Pay Range $240,000 — $300,000 USD Equal Employment Opportunity: SK hynix America is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information, or any other status protected under federal, state, or l