Jobs / United States / Intel Corporation
Ocotillo Failure Analysis Engineer – TEM/Probing Engineer
Intel Corporation · 🇺🇸 US, Arizona, Phoenix
Sponsorship verdict
Posting rules out sponsorship
The posting rules out sponsorship or requires citizenship/clearance.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles78 certified filings for “Software Engineer” (Software Developers) in AZ: $111k–$140k, median $120k. Most were filed at wage level II (59%) — 2 lottery entries, ≈31% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Citizenship requirement statedFrom the posting’s own wording.
- Security clearance mentionedFrom the posting’s own wording.
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
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Why not apply?
Citizenship requirement stated — the posting’s wording suggests candidates who already hold work rights. Read the original listing carefully.
The posting mentions a security clearance — usually restricted to citizens of that country.
SponsorApply flags time-wasters so your applications go where they can land. These come from the posting's own wording — read the original listing to confirm. See better-fit alternatives →
Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful. Join us as a Manufacturing Failure Analysis Engineer, where you'll play a pivotal role in ensuring the quality and reliability of Intel's next-generation silicon, product, package, platforms, and board process technologies. You will identify failures, conduct root cause analyses, and develop innovative methodologies to enhance performance and yield. By leveraging your expertise, you'll contribute to driving manufacturing innovation and supporting the delivery of world-class products. The ideal candidate brings hands-on experience in probing, strong understanding of device behavior, and the ability to independently execute complex debug workflows. Business group You will be part of Intel's manufacturing organization, a cornerstone of our operations that focuses on advancing semiconductor process technologies and ensuring product excellence. This team is dedicated to delivering high-quality solutions that support Intel's broader mission to create groundbreaking technologies that power the future. Key Responsibilities: • Operate general failure analysis tools in the labs, such as TEM, SEM, optical scopes. • Perform electrical probing and advanced characterization on silicon devices (wafer-level and site-specific structures) • Set up, operate, and troubleshoot probe stations and electrical measurement systems. • Execute complex test plans and interpret schematics, layouts, and device structures to support failure analysis workflows. • Analyze electrical data (e.g., IV, CV, leakage, shorts/opens) to support fault isolation and root cause identification. • Partner with FA engineers to integrate probing with SEM, FIB/PFIB, and TEM-based workflows. • Drive improvements in probing methods, workflows, and best-known methods (BKMs) • Provide technical guidance to junior engineers and technicians on probing techniques and lab practices. • Support tool ownership activities including troubleshooting, calibration, and uptime improvement. • Participate in lab sustaining, process transfer, and cross-functional yield improvement initiatives. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your degree, research and or relevant previous job and or internship experiences. Minimum Qualifications: • Bachelor's degree in Electrical Engineering, Materials Science, Physics, Engineering or related STEM fields. • 2+ years of hands-on experience with TEM or FIB or SEM or nanoprobing instrumentation in a lab or applications setting in other techniques OR 2+ years of experience in a lab setting where samples are prepared for analysis. • US citizenship required. • Ability to obtain and maintain a US Government Security Clearance. Preferred Qualifications: • MS, or PhD in Materials Science, Physics, Engineering or related STEM fields • Possibility of working a shifted schedule with at least one weekend day at least two weeks a month. (Sunday-Thursday or