Sponsorship verdict
Sponsorship possible
One solid signal, not two. Worth applying, and worth asking about sponsorship early.
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✓
Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first.
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The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
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No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area.
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✓
Confirmed live todayWhen a source last listed this job as open.
Details and sources
- Employer is on a government sponsor record
- The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. Source: LCA disclosure data (US Department of Labor (OFLC)).
- No salary bar for this route
- H-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence. It is not legal advice and never a guarantee: the employer and the immigration authority decide. Sign in to factor in where you can already work.
About the role
Job Details:
Job Description:
Intel Corporation is a global leader in the semiconductor industry, designing and manufacturing the vital technologies that power our connected world. Within Intel, the Advanced Packaging Technology Development - Substrate and Wafer Assembly (ATPD: SWA) team is at the cutting edge of micro processing evolution. Our mission is to be the premier supplier of leading-edge, cost-effective substrate packaging solutions, enabling the next generation of high-performance computing.
We are seeking a highly motivated Manufacturing Equipment Technician (MTE) - Day Shift - Shift 5 to join our cleanroom operations in Arizona. In this role, you will play a critical part in maintaining, troubleshooting, and optimizing the advanced machinery that makes our microchip packaging possible. Working under general supervision in a fast-paced R&D and production cleanroom, you will support state-of-the-art wet chemistry, plating, and dry high-vacuum toolsets, driving continuous improvement and equipment reliability.
Shift Information
This role operates on Shift 5: 6:00 AM – 6:18 PM on an alternating weekly schedule:
Sun-Tues and alternating Wednesday days
Key Responsibilities:
• Troubleshoot & Repair: Perform complex electrical and mechanical troubleshooting to diagnose and repair non-functioning semiconductor manufacturing equipment.
• Maintenance & Calibration: Conduct routine setup, calibration, and preventive maintenance on high-tech wet chemistry, plating, and dry high-vacuum toolsets.
• Technical Interpretation: Read and interpret complex electrical schematics, blueprints, engineering drawings, and operating manuals to assemble or dismantle hardware.
• Documentation & Compliance: Systematically document all maintenance events, repairs, findings, and parts usage in tracking databases.
• Collaborative Optimization: Partner with engineering, process, and support teams to conduct root-cause analyses, reduce equipment downtime, and implement yield improvement initiatives.
As a Successful Candidate, You Will Bring:
• Strong Judgment & Initiative: Proactively makes data-driven decisions and resolves nonstandard equipment and process anomalies.
• Adaptable & Resilient: Thrives under minimal supervision in a fast-paced, rapidly shifting manufacturing environment.
• Team-Oriented & Self-Motivated: Strong individual ownership of tasks balanced with a dedication to collaborative team goals.
• Multitasking Agility: Welcomes the opportunity to manage multiple toolsets and priorities concurrently.
• Analytical Problem Solver: Logical mindset geared toward systematic troubleshooting and interpretation of equipment logs.
• Effective Communicator: Strong verbal and written communication skills to collaborate seamlessly with peers, engineers, and internal stakeholders.
Are you ready to shape the future of technology and build a world-class career in semiconductor manufacturing? Apply today to join the Intel ATPD team in Arizona!
Qualifications:
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience. This Position is not eligible for Intel immigration sponsorship.
Minimum Qualifications:
Candidates must meet at least one of the following:
• Bachelor's degree in a STEM field or
• Associate degree in a technical field or
• High School Diploma/GED with:
• 2.5+ years of Equipment Maintenance Experience
• or 3+ years of Technical Experience
• or 4+ years
Apply on employer site ↗