Sponsorship verdict
Sponsorship possible
One solid signal, not two. Worth applying, and worth asking about sponsorship early.
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✓
Employer is on a government sponsor recordThe US Department of Labor certified 486 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first.
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The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
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No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area.
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✓
What Hewlett Packard Enterprise Company paid sponsored hires in similar roles2 certified filings for “Electrical/Hardware Engineer II” (Computer Hardware Engineers) in CA: $137k–$208k, median $172k.
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✓
Confirmed live todayWhen a source last listed this job as open.
Details and sources
- Employer is on a government sponsor record
- The US Department of Labor certified 486 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. Source: LCA disclosure data (US Department of Labor (OFLC)).
- No salary bar for this route
- H-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Hewlett Packard Enterprise Company paid sponsored hires in similar roles
- 2 certified filings for “Electrical/Hardware Engineer II” (Computer Hardware Engineers) in CA: $137k–$208k, median $172k. Most were filed at wage level IV (100%) — 4 lottery entries, ≈61% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence. It is not legal advice and never a guarantee: the employer and the immigration authority decide. Sign in to factor in where you can already work.
About the role
Senior Hardware Power Engineer
This role has been designed as ‘’Onsite’ with an expectation that you will primarily work from an HPE office.
Who We Are:
Hewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work. We help companies connect, protect, analyze, and act on their data and applications wherever they live, from edge to cloud, so they can turn insights into outcomes at the speed required to thrive in today’s complex world. Our culture thrives on finding new and better ways to accelerate what’s next. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good. If you are looking to stretch and grow your career our culture will embrace you. Open up opportunities with HPE.
Job Description:
Designs, analyzes, develops, modifies and evaluates electrical/electronic parts, sub-systems or integrated circuitry related to power delivery in the hardware systems. Conducts feasibility studies, design margin and validation analyses on new and modified power supply designs. As a power expert, assists in architecture development of new networking hardware systems. Capable of directing support personnel in the preparation of detailed design, design testing and prototype fabrication.
Role does require being on-site in Sunnyvale 3+ days a week, potentially more to meet business needs.
Management Level Definition:
Contributions impact technical components of HPE products, solutions, or services regularly and sustainable. Applies advanced subject matter knowledge to solve complex business issues and is regarded as a subject matter expert. Provides expertise and partnership to functional and technical project teams and may participate in cross-functional initiatives. Exercises significant independent judgment to determine best method for achieving objectives. May provide team leadership and mentoring to others.
Responsibilities:
The selected candidate will be an Individual Contributor within the Power Systems Development team. Assignments will be at the direction of the Power Systems Development Manager. Typical Board Mount Power activities will include definition of design requirements, selection of critical components, design/simulation/schematic capture of power circuit blocks and coordination with the Board Level and PCB Layout Engineers, and subsequent bring-up and characterization testing of the completed prototype design and introduction to Manufacturing. Similarly, the Front End Power System development process involves System Level Conceptualization, Power Supply Module Functional Specification, and the full cycle of engineering development with HPE Supplier(s), including prototype testing, system integration, documentation and Manufacturing support. Both Board Mount and Front End Power development responsibilities include preparing and/or reviewing test plans and supervising tests as well as in leading the Technical Peer Review of ones work as well as participating in that of other team members. As a Senior Level Individual Contributor, this position will also include Leadership activities such as Mentoring less experienced members of the Power Engineering Team, developing new Technology initiatives within the group, and participating in the HPE Patent application process.
Education and Experience Required:
• Qualified candidates should have a 6+ years related Power Design Engineering experience, with Bachelors in Electrical Engineering degree minimum, Masters of Electrical Engineering is preferred.
• Solid experience with schematic capture and simulation tools (including SPICE) is essential
• Candidate needs to have a practical background with multilayer PCB L
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