Manager Programs 2 - Advanced Packaging

RELOCATION ASSISTANCE: Relocation assistance may be available CLEARANCE REQUIRED FOR START: No CLEARANCE TYPE: Secret TRAVEL: Yes, 10% of the Time Description At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. The Northrop Grumman Microelectronics Center is seeking an Advanced Packaging Program Manager, Level 2 to support the Foundry, Test, and Advanced Packaging Operating Unit’s Advanced Packaging team full-time on-site in Apopka, FL . The selected candidate must be able to travel domestically as required by business needs.   For more than 70 years, Northrop Grumman’s Microelectronics Center, part of Northrop Grumman Mission Systems, has pushed the boundaries in this ever-evolving field of microelectronics. Our U.S.-based, government-trusted foundries and state-of-the-art advanced packaging facilities set the standard, designing and delivering millions of defense and commercial microelectronics components each year. From innovative design to precise fabrication, our mission-tailored solutions provide unparalleled performance, ensuring our technology meets the most demanding challenges.   The Advanced Packaging team develops and deploys next-generation microelectronics packaging technologies for future defense & commercial systems. We focus on development, prototyping, maturation, and scaling of advanced packaging technologies to meet the needs of our customers across these industries.   The selected candidate will be responsible for leading business execution for semiconductor wafer post-processing.  Their primary objective will be developing advanced packaging proposals, introducing new products and processes, and delivering all contractual requirements to our customers on-cost and on-schedule.  They will oversee the development and achievement of all technical objectives, as well as numerous contractual requirements including: managing cost, schedule, and technical performance; leading interfaces with internal and external customers, and company support organizations; supporting insertion of these technologies into customer use cases; identifying volume growth and cost reduction opportunities; and interfacing with technical leadership across our customer base to identify technology needs and timelines to support next-generation microelectronics systems.   What You'll Get to Do: Program Managers are responsible for leading all phases of the program life cycle from inception (proposal technical solution and cost development) through startup, execution, and completion (contract closeout).  Primary responsibilities are the management of cost, schedule, and technical performance of company programs and include, but are not limited to:   • Developing new business opportunities and customer relationships through long term strategic planning, capture planning, and new technology insertion and business plans. • Leading engagements with customers to develop, mature, and deploy advanced packaging solutions. • Leading and directing cross-functional teams to meet program cost, schedule and technical perfor