Wafer Fab Yield Process Engineer

The Senior Wafer Fab Yield Engineer is responsible for driving systematic yield improvement across semiconductor wafer fabrication. This position analyzes manufacturing, inline metrology, defect, wafer-level electrical test, and process data to identify yield-loss mechanisms, determine root causes, and lead implementation of sustainable corrective actions. The engineer serves as a senior technical resource connecting fab process performance to device and product yield. The role works cross-functionally with Process Engineering, Equipment Engineering, Process Integration, Product/Test Engineering, Failure Analysis, Quality, and Manufacturing to improve yield, reduce variability, and accelerate resolution of complex manufacturing problems. Responsibilities: • Lead wafer-fab yield improvement initiatives, identifying and prioritizing the dominant yield-loss mechanisms and converting analysis into actionable improvement projects. • Analyze wafer probe maps, electrical test/bin data, inline metrology, defect inspection data, equipment/process history, and lot genealogy to isolate sources of systematic and random yield loss. • Perform correlation, regression, statistical analysis, wafer spatial analysis, trend analysis, and other data-mining techniques to identify relationships between process conditions and electrical yield. • Lead complex root-cause investigations involving process excursions, recurring yield degradation, wafer-level signatures, equipment effects, materials, and process interactions. • Partner with Process and Equipment Engineering to translate yield signatures into physical process hypotheses and validate corrective actions. • Define and execute structured experiments and DOE to validate suspected yield drivers and optimize process windows. • Use SPC and process-capability analysis to identify process variation and opportunities for improved manufacturing control. • Correlate WAT, wafer sort, inline process-monitoring, defect, and manufacturing data to identify yield improvement opportunities. • Work with Failure Analysis teams to develop appropriate physical-analysis plans and translate findings into manufacturing actions. • Develop analyses and engineering reports that clearly communicate yield trends, excursions, root causes, improvement opportunities, and project status. • Lead cross-functional technical reviews for significant yield excursions and improvement programs. • Support new-product and/or technology introduction by identifying yield risks, establishing baseline performance, and accelerating learning during manufacturing ramp. • Mentor less-experienced engineers in statistical analysis, structured problem solving, yield analysis, and fab troubleshooting. • Identify opportunities to improve fab-wide yield-analysis methods, data infrastructure, and problem-solving practices. • Bachelor's degree in Electrical Engineering, Applied Physics, or a related technical discipline. • Significant engineering experience in semiconductor wafer fabrication, preferably involving yield, process integration, process engineering, product engineering, or device engineering. • Strong understanding of semiconductor wafer fabrication processes and the relationship between process variation, device characteristics, defects, and electrical yield. • Demonstrated ability to perform statistical analysis and solve complex manufacturing problems using large manufacturing datasets. • Experience with statistical/data-analysis tools such as JMP, or comparable platforms. • Working knowledge of SPC, DOE, process capability, correlation/regression, hypothesis testing, and structured root-cause analysis. • Ability to communicate complex technical conclusions clearly to engineering and manufacturing organizations. • Demo