Senior Process Integration Engineer

Job Details: Job Description: The Role and Impact As a Process Integration Development Engineer, you will drive revolutionary advancements in substrate manufacturing technologies, ensuring smooth and efficient integration processes for next-generation packaging solutions. Your primary focus will be working closely with supplier engineering teams to develop and optimize processes, manage capacity, improve yield and enhance lead times. This role is pivotal to Intel's ability to deliver cutting-edge solutions to meet growing customer demand on EMIB-T advanced packaging solutions. Business group The role resides within Intel Corporation's Substrate Packaging Technology Development (SPTD) Dept and in the Substrate Integration Asia group, which focuses on advancing substrate packaging technologies to enable innovative solutions for heterogeneous chip architectures. The group collaborates with global teams and suppliers to deliver scalable manufacturing processes, supporting Intel's broader goals of technology leadership and innovation in advanced packaging. Key Responsibilities • Engage with supplier engineering teams and Intel's US integration group to advance substrate technologies and manage critical process interactions. • Monitor, optimize, and enhance bottleneck processes to reduce throughput time (TPT) and improve efficiencies. • Oversee schedules for product and test vehicle (TV) deliveries, resolving issues to meet aggressive on-time delivery (OTD) goals. • Analyze substrate lead times, develop reduction roadmaps, and ensure quarterly lead time targets are met. • Ensure supplier adherence to Process Control System (PCS) commitments. • Collaborate with internal teams to design and implement factory certification plans focused on yield improvement. • Develop milestone-driven micro-schedules for new factory startups, ensuring supplier compliance with startup timelines. • Lead qualification activities and monitor ramp indicators to ensure seamless production ramp-up for new capacity. • Influence strategic decision-making at supplier management levels through data-driven insights and recommendations. • Expectation is for candidate to be at supplier factory on-site for minimum of 4 days a week. Qualifications: Minimum Qualifications • Bachelor's degree in Science or Engineering with 10+ years, a Master's degree with 8+ years, or a PhD with 6+ years of work experience in a relevant field. • 8+ years of experience in fab back-end or substrate manufacturing process development. • Proficiency in supplier management, yield improvement and lead time analysis, with hands-on experience in structured problem-solving and supplier influence. Preferred Qualifications • Expertise in substrate process building blocks, including component embedding, laser drilling, dielectric lamination, lithography, multi-metal electrolytic plating, defect inspection/metrology, and electrical testing. • Proven experience with process tool qualification in TD/ramp or HVM environments. • Familiarity with factory operations, substrates, manufacturing, process engineering, and yield improvement. • Fluent English communication skills, with exceptional presentation abilities and confidence to engage with supplier management. We invite you to join our dynamic team and make an impact in shaping the future of advanced substrate packaging technologies.            Job Type: Experienced Hire Shift: Shift 1 (Taiwan) Primary Location: Taiwan, Taipei Additional Locations: Taiwan, Hsinchu Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, mar