Jobs / United States / Hewlett Packard Enterprise Company

Hewlett Packard Enterprise Company

Mechanical/Hardware Engineer (Thermal)

Chippewa Falls, Wisconsin, United States of America Posted today

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Sponsorship verdict

Sponsorship possible

One solid signal, not two. Worth applying, and worth asking about sponsorship early.

  • Employer is on a government sponsor recordThe US Department of Labor certified 486 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first.
  • The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
  • No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area.
  • What Hewlett Packard Enterprise Company paid sponsored hires in similar roles2 certified filings for “Electrical/Hardware Engineer II” (Computer Hardware Engineers) in CA: $137k–$208k, median $172k.
  • Confirmed live todayWhen a source last listed this job as open.
Details and sources
Employer is on a government sponsor record
The US Department of Labor certified 486 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. Source: LCA disclosure data (US Department of Labor (OFLC)).
No salary bar for this route
H-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
What Hewlett Packard Enterprise Company paid sponsored hires in similar roles
2 certified filings for “Electrical/Hardware Engineer II” (Computer Hardware Engineers) in CA: $137k–$208k, median $172k. Most were filed at wage level IV (100%) — 4 lottery entries, ≈61% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).

US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).

A verdict summarises public evidence. It is not legal advice and never a guarantee: the employer and the immigration authority decide. Sign in to factor in where you can already work.

About the role

Mechanical/Hardware Engineer (Thermal)    This role has been designed as ‘’Onsite’ with an expectation that you will primarily work from an HPE office. Who We Are: Hewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work. We help companies connect, protect, analyze, and act on their data and applications wherever they live, from edge to cloud, so they can turn insights into outcomes at the speed required to thrive in today’s complex world. Our culture thrives on finding new and better ways to accelerate what’s next. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good. If you are looking to stretch and grow your career our culture will embrace you. Open up opportunities with HPE. Job Description: Job Family Definition: Designs, analyzes, develops, modifies and evaluates materials, mechanical systems, equipment and packaging. Conducts feasibility, design margin and validation analysis and empirical testing on new and modified designs. Leads and/or assists in architecture development and assessment. Evaluates reliability of materials, properties, designs, and techniques used in production. May direct support personnel and/or partner organizations in the preparation of detailed design, design testing, prototype fabrication, and production tooling. Responsible for addressing thermal challenges in support of server designs. This position entails developing and delivering cost effective cooling solutions that are best in class thermally and acoustically. Involves system level thermal design focusing on fan and heatsink technology, materials science, chemistry, fluid flow as well as system level control logic. The job will also include initial concept work, mechanical design, thermal simulation (Flotherm or other software) oversight, and creation of a mockup (dummy heat loads) and solution validation. Responsible for interfacing with vendors on an array of technical issues. Some foreign travel necessary. Management Level Definition: Contributions include applying developed subject matter expertise to solve common and sometimes complex technical problems and recommending alternatives where necessary. Might act as project lead and provide assistance to lower level professionals. Exercises independent judgment and consults with others to determine best method for accomplishing work and achieving objectives. Responsibilities: • Leads multiple project teams of other mechanical hardware engineers and internal and outsourced development partners responsible for all stages of mechanical and thermal development for complex products and platforms, including solution design, validation, tooling and testing. • Manages and expands relationships with internal and outsourced development partners on mechanical and thermal design and development • Reviews and evaluates designs and project activities for compliance with technology and development guidelines and standards; provides tangible feedback to improve product quality • Provides domain-specific expertise and overall mechanical/thermal leadership and perspective to cross-organization projects, programs, and activities • Drives innovation and integration of new technologies into projects and activities in the mechanical and thermal design organization. • Provides guidance and mentoring to less- experienced staff members • Communicates well verbally, in writing, and graphically • Works independently and as part of a team Education and Experience Required: • Bachelor's or Master's degree in Mechanical Engineering. • Typically 4-6 years experience. Knowledge and Skills: • Proficiency with ProEngineer, Solidworks or other 3

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