Manufacturing Operations Manager Day Shift - Advanced Packaging

Job Details: Job Description: At Intel, we create world-changing technology that improves the life of every person on the planet. By joining the Substrate Packaging Technology Development (SPTD) organization within our Advanced Packaging Team, you will support our mission to be the supplier of choice for leading-edge, affordable advanced substrate packaging solutions. This is your opportunity to lead a high-performing team that values technical excellence, continuous learning, and a collaborative, supportive work environment.   We are seeking a Manufacturing Operations Manager Day Shift - Advanced Packaging to join our advanced packaging operations in Chandler, Arizona. In this role, you will lead and develop a team of highly skilled technicians responsible for equipment maintenance, troubleshooting, tool recovery, and daily factory execution. Working hands-on in our dynamic manufacturing facility, you will maintain a visible shift presence to strengthen team performance, optimize equipment stability, and directly support the strategic goals that enable Intel's continued packaging leadership.   Shift Information:  • Shift 7 • Shift Hours: 6:00 AM – 6:00 PM • Schedule: (days backend) AM-PM Thurs-Sat and alternating Wednesday days   Key Responsibilities: • Shift Team Leadership: Lead, schedule, and develop a shift team of technical equipment technicians, managing daily workstation assignments, rotations, and performance standards. • Maintenance & Resource Planning: Build and execute detailed resource plans for corrective and preventive maintenance activities to maximize equipment uptime and stability. • Continuous Improvement Leadership: Own shift performance metrics (safety, quality, cost, and output) by driving continuous improvement initiatives using structured Lean, Six Sigma, or Model-Based Problem Solving (MBPS) methodologies. • Training Program Execution: Establish, evaluate, and execute technical training plans to systematically upgrade technician skills aligned with manufacturing roadmap requirements. • Cross-Functional Engineering Collaboration: Partner directly with Module Engineering groups to resolve systemic hardware faults, execute tooling improvements, and stabilize manufacturing processes. • Operational Policy & Safety Enforcement: Enforce strict compliance with Intel safety guidelines, factory protocols, and operational policies on shift.   As a Successful Candidate, You Will Bring: • Dynamic Leadership & People Development: Natural talent for building, coaching, and motivating high-performing technical teams in a fast-paced environment. • Structured Problem Solving: Passion for utilizing logical, data-driven methodologies to dissect complex manufacturing bottlenecks and equipment failures. • Exceptional Communication: Clear, direct, and diplomatic verbal and written communication style to align priorities across shift handoffs and engineering teams. • Strategic Executive Presence: Comfort managing critical, high-urgency factory excursions while maintaining structural standards and promoting corporate values.   Apply today to join Intel Arizona's Substrate Packaging Technology Development team. Take command of cutting-edge shift operations, develop the next generation of technical talent, and build a rewarding career at the forefront of semiconductor innovation. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience. This