Jobs / United States / Intel Corporation

Intel Corporation

Senior / Staff Dry Etch Process Development Engineer

US, New Mexico, Albuquerque Posted today

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Skills this job asks for

Product managementLeadershipStatistics

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Sponsorship verdict

Sponsorship possible

One solid signal, not two. Worth applying, and worth asking about sponsorship early.

  • Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first.
  • The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
  • No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area.
  • What Intel Corporation paid sponsored hires in similar roles46 certified filings for “Process Engineer” (Materials Engineers) in NM: $96k–$96k, median $96k.
  • Confirmed live todayWhen a source last listed this job as open.
Details and sources
Employer is on a government sponsor record
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. Source: LCA disclosure data (US Department of Labor (OFLC)).
No salary bar for this route
H-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
What Intel Corporation paid sponsored hires in similar roles
46 certified filings for “Process Engineer” (Materials Engineers) in NM: $96k–$96k, median $96k. Most were filed at wage level II (80%) — 2 lottery entries, ≈31% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).

US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).

A verdict summarises public evidence. It is not legal advice and never a guarantee: the employer and the immigration authority decide. Sign in to factor in where you can already work.

About the role

Job Details: Job Description: The Role and Impact As a Module Development Engineer, you will lead the design, development, and optimization of cutting-edge manufacturing processes and equipment solutions that enable Intel's innovative device architectures. Your day-to-day responsibilities will include conducting feasibility studies, driving process integration, and collaborating with cross-functional teams to ensure process readiness and scalability for high-volume manufacturing. Your contributions will play a pivotal role in advancing Intel's technology roadmap while optimizing production efficiency and achieving superior product performance and quality. Business group Intel Corporation's Manufacturing and Operations organization is dedicated to delivering world-class manufacturing processes that support Intel's leadership in semiconductor innovation. The team focuses on developing advanced technologies and manufacturing solutions to meet evolving industry demands. Through collaboration across global teams, this group drives Intel's mission to create transformative technology that powers the future. Key Responsibilities - Lead the development and implementation of technically sophisticated manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design. - Perform process integration and provide solutions to meet desired device specifications for high-volume manufacturing and future technologies. - Conduct research and pathfinding activities to enable the manufacture of innovative device architectures and ensure scalability for high-volume production. - Develop roadmaps and strategies for technology processes that align with Intel's future goals while maintaining cost sensitivity. - Collaborate with equipment and materials suppliers to enable process advancements and enhance production outputs. - Perform feasibility studies using theoretical simulations and practical engineering methods to evaluate process technology capabilities. - Recommend and implement modifications to manufacturing processes and equipment to optimize efficiency, reliability, and yield. - Stay updated on industry trends and technical advancements to drive innovation and maintain Intel's competitive edge. Qualifications:   • PhD in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or a related STEM field, with at least 5 years of semiconductor Dry Etch/Plasma Etch process development experience; OR • Master’s degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field, with at least 7 years of semiconductor Dry Etch/Plasma Etch process development experience; OR • Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field, with at least 10 years of semiconductor Dry Etch/Plasma Etch process development experience. • 2 years of experience applying Design of Experiments (DOE) and Statistical Process Control (SPC) methodologies in semiconductor process development and optimization. • 2+ years of experience leading cross-functional semiconductor process development projects, collaborating across multiple engineering disciplines (e.g., process engineering, integration, yield, and equipment engineering) and driving technical solutions to achieve project and manufacturing objectives. Preferred Qualifications • Experience with advanced Dry Etch/Plasma Etch technologies, including Through-Silicon Via (TSV) processes. • Experience working in semiconductor foundry or advanced technology development environments. • Experience with process automation systems and advanced process control methodologies. • Experience collaborat

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