Jobs / United States / Diamond Foundry INC

Diamond Foundry INC

Application Engineering Director

Bay Area, California Posted today

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Sponsorship verdict

Sponsorship possible

One solid signal, not two. Worth applying, and worth asking about sponsorship early.

  • Employer is on a government sponsor recordThe US Department of Labor certified 9 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest May 2026) — the step every H-1B hire needs first.
  • The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
  • No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area.
  • Confirmed live todayWhen a source last listed this job as open.
Details and sources
Employer is on a government sponsor record
The US Department of Labor certified 9 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest May 2026) — the step every H-1B hire needs first. Source: LCA disclosure data (US Department of Labor (OFLC)).
No salary bar for this route
H-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.

US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).

A verdict summarises public evidence. It is not legal advice and never a guarantee: the employer and the immigration authority decide. Sign in to factor in where you can already work.

About the role

Diamond Foundry Inc. is solving the thermal limitation at the foundation of today's most exciting tech industries -- AI & cloud compute, electric-car power electronics, and 5G/6G wireless. We have managed to produce the world's first single-crystal diamond wafers and are now on a mission to put a diamond behind every chip. We are the rare unicorn that has grown fast and profitably. We received $515m in funding and are executing a multi-$B expansion plan for one of the greenest forms of tech manufacturing: converting greenhouse gas into diamond wafers using zero-emission energy. Diamond Foundry is seeking an experienced Director of Application Engineering to lead how our single-crystal diamond is integrated into semiconductor devices, with a focus on advanced bonding and packaging. As the world’s leading producer of lab-grown diamond, we are growing our application engineering team to support semiconductor and AI chip customers who need better thermal performance. This role owns the technical bonding strategy and turns it into customer programs, roadmaps, and paths to production. The ideal candidate is a recognized bonding and advanced packaging expert who can still go hands-on in the lab and can also present technical strategy, risks, and tradeoffs to executive leadership and customers. You can move a process from early prototype through qualification to high-volume manufacturing, and you can build a team that does the same.

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