Packaging Module Development Engineer

Job Details: Job Description: Intel's Substrate Packaging Technology Development (SPTD) organization is seeking a talented and driven Packaging Module Development Engineer to join our Arizona-based team. In this role, you will be at the forefront of developing cutting-edge packaging processes and equipment that enable Intel's next-generation semiconductor technologies. You will play a critical role in advancing heterogeneous integration and die disaggregation solutions that support Intel's global product roadmap — from high-performance computing to mobile applications. This is a unique opportunity to work alongside world-class engineers, contribute to groundbreaking research and development, and directly influence the future of advanced semiconductor packaging at one of the most recognized technology companies in the world. Key Responsibilities • Develop and qualify advanced packaging processes, materials, and equipment to meet reliability, yield, and cost targets in high-volume manufacturing environments. • Design and implement process specifications, prototype workflows, and equipment configurations for emerging packaging technologies. • Conduct Design of Experiments (DOE) to analyze process windows and understand interactions between materials, equipment, and chemistry. • Drive continuous process improvements to enhance capability, stability, quality, and overall productivity. • Collaborate with cross-functional teams — including design, materials, and manufacturing — to resolve complex technical challenges and deliver impactful solutions. • Establish material specifications and partner with suppliers to ensure adherence to performance and quality standards. • Document technical findings and process innovations through detailed reports and technical papers. • Support standardization of manufacturing systems and qualification procedures to ensure consistency and scalability across global operations. • Provide sustaining support for equipment performance and process health in high-volume manufacturing settings. As a successful candidate, you must possess • Collaborative Spirit — You thrive in team environments and enjoy working across diverse, cross-functional groups to achieve shared goals. • Intellectual Curiosity — You have a passion for learning, exploring new technologies, and asking the right questions to drive innovation. • Adaptability — You embrace change and can pivot quickly in a fast-paced, dynamic environment without losing focus or momentum. • Effective Communication — You can clearly articulate complex technical concepts to both technical and non-technical audiences, both verbally and in writing. • Problem-Solving Mindset — You approach challenges with a structured, analytical mindset and a determination to find creative, practical solutions. • Attention to Detail — You take pride in precision and thoroughness, ensuring that your work meets the highest standards of quality. • Initiative & Ownership — You are proactive, self-motivated, and take full ownership of your projects from concept through to completion. • Resilience — You remain composed and focused under pressure, especially when navigating complex technical or organizational challenges. Are you ready to shape the future of semiconductor technology? Join Intel's Advanced Packaging team in Arizona and be part of a world-class organization that is redefining what's possible in chip design and manufacturing. If you are passionate about innovation, thrive in collaborative environments, and want to make a lasting impact on the technology that powers the world — we want to hear from you. Qualifications: This is an entry level position and will be compensated accordingly. You must possess the below minimum qualifications to be initially cons