Jobs / United States / Hewlett Packard Enterprise Company

Hewlett Packard Enterprise Company

Mechanical Design Engineering Intern

Roseville, California, United States of America Posted today

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Sponsorship verdict

Sponsorship possible

One solid signal, not two. Worth applying, and worth asking about sponsorship early.

  • Employer is on a government sponsor recordThe US Department of Labor certified 486 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first.
  • The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
  • No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area.
  • What Hewlett Packard Enterprise Company paid sponsored hires in similar roles2 certified filings for “Electrical R&D Technician VI” (Electrical and Electronic Engineering Technologists and Technicians) in NC: $82k–$82k, median $82k.
  • Confirmed live todayWhen a source last listed this job as open.
Details and sources
Employer is on a government sponsor record
The US Department of Labor certified 486 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. Source: LCA disclosure data (US Department of Labor (OFLC)).
No salary bar for this route
H-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
What Hewlett Packard Enterprise Company paid sponsored hires in similar roles
2 certified filings for “Electrical R&D Technician VI” (Electrical and Electronic Engineering Technologists and Technicians) in NC: $82k–$82k, median $82k. Most were filed at wage level IV (100%) — 4 lottery entries, ≈61% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).

US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).

A verdict summarises public evidence. It is not legal advice and never a guarantee: the employer and the immigration authority decide. Sign in to factor in where you can already work.

About the role

Mechanical Design Engineering Intern    This role has been designed as ‘’Onsite’ with an expectation that you will primarily work from an HPE office. Who We Are: Hewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work. We help companies connect, protect, analyze, and act on their data and applications wherever they live, from edge to cloud, so they can turn insights into outcomes at the speed required to thrive in today’s complex world. Our culture thrives on finding new and better ways to accelerate what’s next. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good. If you are looking to stretch and grow your career our culture will embrace you. Open up opportunities with HPE. Job Description: Join the Mechanical/Thermal Engineering team at HPE Aruba Networking and help shape the next generation of high-performance networking products! Our Hardware R&D team tackles exciting engineering challenges to advance the performance, reliability, and quality of HPE Aruba switching products. As a Mechanical/Thermal Engineering Intern, you will work alongside experienced engineers on real-world hardware development projects, gaining hands-on experience in mechanical design, thermal management, CAD modeling, simulation, and experimental testing. You will contribute to evaluating design concepts, analyzing thermal and mechanical performance, validating prototypes, and identifying opportunities for design improvements. By collaborating with cross-functional teams and exploring innovative engineering solutions, you will help transform engineering concepts into reliable, high-quality networking products while building valuable technical skills and laying the foundation for your engineering career.   Responsibilities   Project assignments will align with business priorities while considering the intern's technical interests, skills, and development goals. We welcome self-motivated, creative engineering students interested in mechanical engineering, thermal management, materials science, product design, structural analysis, and related fields. • Support engineering projects involving mechanical design, thermal analysis, simulation, and product validation. • Assist with 3D CAD modeling and design evaluation of mechanical components, enclosures, heatsinks, and other hardware assemblies. • Evaluate airflow, heat dissipation, and thermal performance using engineering simulations and analytical methods. • Support prototype development, laboratory testing, and validation of mechanical and thermal designs. • Analyze test data and simulation results to identify performance issues and recommend design improvements. • Troubleshoot engineering challenges and collaborate with team members to develop effective solutions. • Document engineering analyses, test results, and recommendations, and communicate findings during project reviews. • Collaborate with cross-functional teams and explore new engineering tools and methodologies to support product development. •   Education & Experience   • Currently pursuing a bachelor's degree in Mechanical Engineering, Thermal Engineering, or a related engineering field. • Prior related experience is a plus.   Knowledge & Skills   • Basic understanding of mechanical design, heat transfer, thermodynamics, fluid mechanics, or related engineering principles. • Strong analytical, problem-solving, and troubleshooting skills. • Familiarity with 3D CAD software such as Creo, SolidWorks, or similar mechanical design tools. • Familiarity with thermal analysis or engineering simulation software such as FloTHERM, ANSYS, or similar tools. • Excellent c

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