Sponsorship verdict
Sponsorship possible
One solid signal, not two. Worth applying, and worth asking about sponsorship early.
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✓
Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first.
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The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
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No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area.
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✓
What Intel Corporation paid sponsored hires in similar roles46 certified filings for “Process Engineer” (Materials Engineers) in NM: $96k–$96k, median $96k.
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✓
Confirmed live todayWhen a source last listed this job as open.
Details and sources
- Employer is on a government sponsor record
- The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. Source: LCA disclosure data (US Department of Labor (OFLC)).
- No salary bar for this route
- H-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles
- 46 certified filings for “Process Engineer” (Materials Engineers) in NM: $96k–$96k, median $96k. Most were filed at wage level II (80%) — 2 lottery entries, ≈31% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence. It is not legal advice and never a guarantee: the employer and the immigration authority decide. Sign in to factor in where you can already work.
About the role
Job Details:
Job Description:
As a Silicon Photonics (SiP) Process or Product Integration Engineer, you will be part of Intel's SiP Process Development and Manufacturing (SPDM) team that is leading Intel's market transition and driving innovation for the next generation of optical interconnect products. You will play a critical role in the next generation of silicon photonics product roadmaps, fabrication process development, yield improvement roadmaps, and reliability qualifications.
Primary Responsibilities:
• A Process Integrator collaborates with Yield Analysis, Device and Defect Engineers, IPS (SiP Product Division) designers, and Process Engineers to ensure new processes and products are capable of meeting yield and reliability requirements at the time of PRQ.
• Defines and establishes process flow, procedures, and required equipment to develop new devices or products. Plans and conducts experiments to fully characterize the process throughout the development cycle.
• Trains production/receiving engineers for transfer to high volume manufacturing.
• A Product Integration Engineer (PIE) will act as a key technical leader and the primary fab contact for integrating one or more products from customer roadmaps into F11x's fabrication process.
• You will be responsible for driving and managing yield optimization efforts, New Product Introduction (NPI) roadmaps, process development, and Test/SORT/Burn-in capacity/capability to deliver product qualification milestones throughout all phases of the product life cycle (PLC).
• You will be highly engaged in cross-functional teams to solve technical problems and deliver product milestones; interfacing between IPS, F11x process engineering, finance, planning, wafer-level test, quality and reliability (QnR), and OSAT teams.
Qualifications:
You must possess the minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and/or schoolwork/classes/research.
Minimum Qualifications
• Bachelors in Engineering (Chemical, Electrical, Materials, etc.) and/or Science discipline such as Materials Science, Physics, Optics/Photonics.
• 2+ years of experience in semiconductor and/or silicon photonics process technology.
• 2+ years of experience in advanced data analysis (using JMP, GAJT and/or SQL), statistical process control (SPC), and design of experiment (DOE) principles.
Preferred Requirements:
• Masters or Ph.D. in Engineering (Chemical, Electrical, Materials, etc.) and/or Science discipline such as Materials Science, Physics, Optics/Photonics.
• 1+ years of experience in any of the following: Optics, Photonics, SiP, Lasers, or III/V compound.
• 1+ years of experience with process integration roles in silicon photonics or other semiconductor technologies.
• Good time management skills, self-motivated, and have strong desire to succeed in a fast-paced and challenging environment. Ability to learn quickly, be resourceful and have strong problem solving skills.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, New Mexico, Albuquerque
Additional Locations:
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by loca
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