Sponsorship verdict
Sponsorship possible
One solid signal, not two. Worth applying, and worth asking about sponsorship early.
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✓
Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first.
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The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
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No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area.
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✓
What Intel Corporation paid sponsored hires in similar roles46 certified filings for “Process Engineer” (Materials Engineers) in NM: $96k–$96k, median $96k.
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✓
Confirmed live todayWhen a source last listed this job as open.
Details and sources
- Employer is on a government sponsor record
- The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. Source: LCA disclosure data (US Department of Labor (OFLC)).
- No salary bar for this route
- H-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles
- 46 certified filings for “Process Engineer” (Materials Engineers) in NM: $96k–$96k, median $96k. Most were filed at wage level II (80%) — 2 lottery entries, ≈31% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence. It is not legal advice and never a guarantee: the employer and the immigration authority decide. Sign in to factor in where you can already work.
About the role
Job Details:
Job Description:
The Role and Impact
New Mexico is Intel's flagship high-volume Advanced Packaging manufacturing site, providing full co-location of the Advanced Packaging line at a single site, with New Mexico Die Sort (NM DS) serving as a key segment of the manufacturing operation.
As a Die Sort Module Engineer, you will play an essential role in ensuring the efficiency and reliability of high-volume manufacturing equipment and processes that support Intel's advanced semiconductor production.
You will be responsible for monitoring, maintaining, troubleshooting, and optimizing semiconductor sort equipment to meet quality, safety, and operational goals while contributing to the development and implementation of innovative process solutions.
Your work will directly impact Intel's ability to deliver cutting-edge technologies at scale, supporting both current and future semiconductor manufacturing needs. This position offers an opportunity to contribute to Intel's foundry and Advanced Packaging success while driving innovation, process improvements, and operational excellence.
Key Responsibilities
• Own and optimize sort equipment performance, including advanced troubleshooting, preventive maintenance and repair improvements, process monitoring, data analysis, and excursion response.
• Drive improvements in safety, quality, equipment availability, yield, cost, standardization, process control, and manufacturability.
• Develop, implement, and optimize recipes for new product introductions (NPIs) and existing production processes.
• Partner with Technology Development (TD) teams to transfer and optimize new processes and technologies.
• Explore and develop improved semiconductor sort/test methodologies and techniques to support new and emerging technologies.
• Perform root-cause analysis and implement corrective actions for integrated processing issues in collaboration with other modules, upstream and downstream partners, and cross-functional engineering teams.
• Collaborate with Virtual Factory (VF) partners to drive and implement global process and operational improvements.
• Provide training, mentoring, and coaching to technicians while maintaining a customer-oriented approach to manufacturing support and promoting innovation and collaboration.
• Oversee the installation, qualification, and maintenance of new and existing equipment during factory ramps.
• Develop and maintain strong partnerships with internal teams and external equipment vendors and technology developers.
Desired Skills and Behavioral Traits
• Demonstrated experience with statistical process control methodologies and engineering analysis tools.
• Interest in and demonstrated hands-on experience with semiconductor process and equipment troubleshooting, repair, and/or development.
• Proficiency in model-based problem-solving and root-cause analysis methodologies, including MBPS, DOE, FMEA, or equivalent approaches.
• Strong verbal and written communication skills, with the ability to influence peers and managers and communicate complex technical information clearly and concisely.
• Demonstrated disciplined execution and the ability to act with an appropriate level of urgency.
• Results-oriented, organized, resourceful, and self-directed, with the ability to demonstrate initiative and work independently.
• Strong attention to quality and detail, with the ability to maintain high standards in manufacturing operations.
• Ability to adapt to new and frequently changing challenges in a high-volume manufacturing environment.
• Ability to manage multiple priorities across process engineering, equipment sustaining, continuous improvement, process transfer, and Virtual Factory activities.
• Ability to work effectively within and across org
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