Senior Optical Packaging Engineer

PsiQuantum’s mission is to build the first useful quantum computers—machines capable of delivering the breakthroughs the field has long promised. Since our founding in 2016, our singular focus has been to build and deploy million-qubit, fault-tolerant quantum systems. Quantum computers harness the laws of quantum mechanics to solve problems that even the most advanced supercomputers or AI systems will never reach. Their impact will span energy, pharmaceuticals, finance, agriculture, transportation, materials, and other foundational industries. Our architecture and approach is based on silicon photonics. By leveraging the advanced semiconductor manufacturing industry—including partners like GlobalFoundries—we use the same high-volume processes that already produce billions of chips for telecom and consumer electronics. Photonics offers natural advantages for scale: photons don’t feel heat, are immune to electromagnetic interference, and integrate with existing cryogenic cooling and standard fiber-optic infrastructure. In 2024, PsiQuantum announced government-funded projects to support the build-out of our first utility-scale quantum computers in Brisbane, Australia, and Chicago, Illinois. These initiatives reflect a growing recognition that quantum computing will be strategically and economically defining—and that now is the time to scale. PsiQuantum also develops the algorithms and software needed to make these systems commercially valuable. Our application, software, and industry teams work directly with leading Fortune 500 companies—including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical—to prepare quantum solutions for real-world impact. Quantum computing is not an extension of classical computing. It represents a fundamental shift—and a path to mastering challenges that cannot be solved any other way. The potential is enormous, and we have a clear path to make it real. Come join us. Job Summary: The Senior Optical Packaging Engineer is responsible for developing & implementing a high-performance & robust fiber-to-chip package and a scalable packaging process for optical systems comprised of optical fibers attached to a variety of chip-based photonic integrated circuits. Responsibilities: • Develop an optical package and fiber-to-chip alignment scheme that allows for high alignment accuracy and scalable assembly. • Help develop packaging prototypes & scalable fiber-to-chip packaging flows, NPI.Review packaging design BOMs, work with supply chain on procuring parts needed for assembly. • Establish and update version-controlled DFM requirements and feed back to packaging design group. • Design, execute, summarize and analyze experiments & process trend studies to improve the performance and reliability of optical packaged assemblies. • Work with manufacturing group and vendors on transferring & scaling packaging designs and processes based on successful prototypes. • Advise manufacturing group and vendors on setup of high-throughput packaging assembly lines. • Work with external vendors and suppliers to source required materials and provide feedback on evolving requirements. Experience/Qualifications: • Master’s Degree or above in Engineering, Physics or Material Science. • 10+ years of experience with/at semiconductor company or supplier working on PIC packaging design, qualification & multi-chip assemblies. • 5+ years of experience working with optical fibers, optical measurements. • 5+ years of work experience with advanced semiconductor packaging OSAT (Outsourced Semiconductor Assembly & Test) and/or EOL vendors. • 5+ years of experience with semiconductor company or supplier working on FAU / optical connector to chip attachment. • Experience with fiber attach tooling &am