Process and Equipment Engineer

Job Details: Job Description: The Role and Impact As a Process and Equipment Engineer specializing in Wafer Laser and Saw Singulation Technologies, you will serve as the technical owner responsible for driving the performance, capability, and stability of advanced wafer singulation processes within our high-volume semiconductor manufacturing environment. In this role, you will leverage your expertise in precision laser-material interaction, wafer dicing, laser ablation, and singulation technologies to solve complex process and equipment challenges, optimize manufacturing performance, and implement innovative solutions that enable next-generation semiconductor products. Your hands-on contributions will directly impact factory yield, quality, equipment uptime, Manufacturing Availability (MA), cost competitiveness, and process robustness. You will play a critical role in supporting Intel's advanced packaging, NPI and wafer manufacturing roadmap through the deployment of cutting-edge laser and sawing technologies. Business group: As part of Intel Wafer Packaging Manufacturing (WPM), you will join a globally recognized organization at the forefront of semiconductor manufacturing and advanced packaging technologies. Our organization develops and deploys innovative wafer processing, laser manufacturing, and singulation solutions that enable Intel's next-generation computing platforms. The Wafer Laser Ablation and Saw Engineering team plays a critical role in delivering high-yield, high-quality wafer singulation processes through the integration of advanced laser processing, precision sawing, automation, data analytics, and AI-driven manufacturing solutions. We continuously push the boundaries of wafer processing capability to meet increasingly demanding product requirements across advanced packaging and silicon technologies. Working within a highly collaborative environment, you will partner with global factory networks, technology development teams, virtual factories, equipment suppliers, and manufacturing stakeholders to develop breakthrough solutions that improve yield, quality, cost, and manufacturing scalability. This role offers unique opportunities to influence future technology roadmaps while supporting Intel's mission to create world-changing technology that improves the life of every person on the planet. Key Responsibilities: Process Optimization - Own and optimize laser ablation and wafer saw process parameters to achieve best-in-class yield, quality, and throughput. Yield Improvement - Drive systematic defect reduction initiatives targeting burrs, chipping, cracking, kerf quality, and recast. Equipment Engineering - Lead complex troubleshooting and reliability improvements for laser ablation, laser dicing, and wafer saw equipment. Maintenance Strategy - Develop and execute preventive and corrective maintenance plans to maximize equipment uptime and MA. Data Analytics - Utilize SPC, DOE, FMEA,JMP and advanced analytics to identify root causes of process variation and equipment failures. Automation and AI Solutions - Develop and deploy Python/Co-pilot/Github/ Gemini- and AI-based solutions for defect monitoring, predictive maintenance, and process optimization. Technology Development - Collaborate with TD teams to evaluate, develop, and qualify next-generation laser processing and singulation technologies. New Product Introduction (NPI) - Support process qualification, technology transfer, and high-volume manufacturing ramp for new products. Cross-Functional Collaboration - Partner with upstream and downstream process owners to improve end-to-end manufacturing performance. Supplier Engagement - Work closely with equipment vendors to implement hardware upgrades, software enhancements, and productivity improvements. Document