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Intel Corporation

Senior PDK Physical Verification Engineer

4 Locations Posted today

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Skills this job asks for

LeadershipComplianceProduct management

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Sponsorship verdict

Sponsorship possible

One solid signal, not two. Worth applying, and worth asking about sponsorship early.

  • Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first.
  • The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
  • No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area.
  • What Intel Corporation paid sponsored hires in similar roles287 certified filings for “Process Engineer” (Materials Engineers) in OR: $113k–$133k, median $133k.
  • Confirmed live todayWhen a source last listed this job as open.
Details and sources
Employer is on a government sponsor record
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. Source: LCA disclosure data (US Department of Labor (OFLC)).
No salary bar for this route
H-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
What Intel Corporation paid sponsored hires in similar roles
287 certified filings for “Process Engineer” (Materials Engineers) in OR: $113k–$133k, median $133k. Most were filed at wage level III (87%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).

US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).

A verdict summarises public evidence. It is not legal advice and never a guarantee: the employer and the immigration authority decide. Sign in to factor in where you can already work.

About the role

Job Details: Job Description: Shape the Future of Advanced Semiconductor Technology at Intel Join Intel's Design Technology Platform (DTP) organization and become part of a world-class team enabling the next generation of semiconductor innovation. In this highly visible role, you will develop and deploy advanced density fill methodologies and Process Design Kit (PDK) solutions that directly impact Intel's most advanced technology nodes and product designs. Working at the intersection of process technology, physical verification, and design automation, you will collaborate with leading engineers across Intel and the EDA ecosystem to solve complex manufacturability challenges, improve design productivity, and enable breakthrough technologies. Your contributions will influence how future products are designed and manufactured, helping Intel maintain technology leadership in an increasingly competitive industry. What You'll Do • Lead the development, implementation, and validation of density fill solutions within advanced Process Design Kits (PDKs). • Develop algorithmic solutions using industry-leading physical verification platforms, including Calibre, Synopsys ICV, and Cadence Pegasus, to ensure density compliance and manufacturability across advanced process technologies. • Collaborate with process integration teams, design rule owners, product design engineers, and customers to define requirements and deliver state-of-the-art solutions. • Drive automation initiatives that improve engineering efficiency, solution scalability, and deployment across multiple design environments. • Design and develop robust validation frameworks, test suites, and qualification methodologies to ensure high-quality tool and rule deck releases. • Advance innovative physical verification methodologies to address emerging challenges associated with technology scaling. • Partner closely with external EDA vendors to influence and deploy next-generation tool capabilities and methodologies. • Develop technical documentation, training materials, and best practices that enable successful adoption across Intel's design community. • Serve as a technical expert and contribute to strategic initiatives that shape Intel's design enablement roadmap.   Ideal Candidate Background We are particularly interested in candidates who have developed physical verification methodologies, density-fill solutions, or PDK technologies within: • Semiconductor Foundries. • Integrated Device Manufacturers (IDMs). • Advanced Packaging and OSAT Organizations. • EDA Software Companies. • Design Enablement or CAD Teams supporting advanced-node development.   Core Competencies • Excellent communication and technical presentation skills, with the ability to translate complex technical concepts into actionable solutions. • Strong problem-solving, debugging, and analytical skills. • Strong understanding of technology scaling challenges and their impact on physical verification and design rule development. Qualifications: The Minimum qualifications are required to be initially considered for this position.  Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications • Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field with 6+ years of relevant experience; • OR - Master's degree with 5+ years of experience. • OR - PhD with 2+ years of experience. • 4+ years of hands-on experience with at least one industry-standard physical verification p

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