Jobs / United States / Hewlett Packard Enterprise Company

Hewlett Packard Enterprise Company

Senior Principal Thermal Engineer

Sunnyvale, California, United States of America; 2 Locations Posted today

Apply on employer site ↗ Tailor my CV first Source: Company careers site

Optional: we can tailor a CV and cover letter for this job from your real experience first (the first one is free).

Skills this job asks for

NetworkingLeadershipProduct managementAirflow

Add your CV (free) to see which of these your CV is missing.

Sponsorship verdict

Sponsorship possible

One solid signal, not two. Worth applying, and worth asking about sponsorship early.

  • Employer is on a government sponsor recordThe US Department of Labor certified 486 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first.
  • The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
  • No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area.
  • What Hewlett Packard Enterprise Company paid sponsored hires in similar roles59 certified filings for “Systems/Software Engineer III” (Software Developers) in CA: $149k–$206k, median $183k.
  • Confirmed live todayWhen a source last listed this job as open.
Details and sources
Employer is on a government sponsor record
The US Department of Labor certified 486 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. Source: LCA disclosure data (US Department of Labor (OFLC)).
No salary bar for this route
H-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
What Hewlett Packard Enterprise Company paid sponsored hires in similar roles
59 certified filings for “Systems/Software Engineer III” (Software Developers) in CA: $149k–$206k, median $183k. Most were filed at wage level II (43%) — 2 lottery entries, ≈31% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).

US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).

A verdict summarises public evidence. It is not legal advice and never a guarantee: the employer and the immigration authority decide. Sign in to factor in where you can already work.

About the role

Senior Principal Thermal Engineer    This role has been designed as ‘’Onsite’ with an expectation that you will primarily work from an HPE office. Who We Are: Hewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work. We help companies connect, protect, analyze, and act on their data and applications wherever they live, from edge to cloud, so they can turn insights into outcomes at the speed required to thrive in today’s complex world. Our culture thrives on finding new and better ways to accelerate what’s next. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good. If you are looking to stretch and grow your career our culture will embrace you. Open up opportunities with HPE. Job Description: HPE is seeking a Senior Principal Thermal Engineer who is a recognized authority in advanced thermal management technologies for high-performance networking, AI, compute, and data-center hardware. This role will define and drive the future thermal technology vision, architectures, methodologies, and innovation roadmaps spanning advanced air cooling, liquid cooling, hybrid cooling, and emerging thermal solutions. The engineer will identify, evaluate, and mature next-generation cooling technologies, guide long-term platform strategies, influence industry direction, and solve critical business and customer challenges. Through deep technical leadership and innovation, this individual will deliver substantial, long-lasting impact in performance, reliability, energy efficiency, sustainability, cost optimization, and product differentiation. The successful candidate will influence executive and cross-functional decisions, shape technology investments, collaborate with industry partners and suppliers, contribute to standards development, mentor engineers, and strengthen HPE's technical community. Detailed Job Description   Responsibilities • Define and drive the long-term thermal technology vision, strategy, and roadmap for HPE Networking products spanning advanced air cooling, liquid cooling, hybrid cooling, and emerging thermal management technologies. • Identify, evaluate, mature, and recommend next-generation cooling technologies required to support future AI, networking, high-performance compute, and data-center platforms. • Establish organization-wide thermal architectures, design methodologies, technology standards, modeling practices, and validation frameworks used across multiple business units and product generations. • Serve as the senior technical authority and thought leader for advanced thermal management technologies, including high-performance heat sinks, vapor chambers, heat pipes, fan and airflow systems, cold plates, manifold architectures, immersion cooling, coolant distribution systems, facility water integration, and emerging two-phase cooling solutions. • Lead early-stage technology investigations, proof-of-concept development, feasibility studies, competitive benchmarking, and technology readiness assessments to enable future product roadmaps. • Evaluate thermal implications of future silicon, optics, packaging, power delivery, rack-scale architectures, and AI infrastructure trends; develop cooling strategies that enable next-generation performance requirements. • Define technical requirements and assessment criteria for new cooling technologies, including thermal performance, airflow management, coolant flow distribution, reliability, energy efficiency, sustainability, serviceability, manufacturability, acoustic performance, and total cost of ownership. • Review critical product architectures and provide expert guidance on thermal design tradeoffs, ri

Apply on employer site ↗