Thin Films Module Development Engineer

Job Details: Job Description: Intel Foundry is seeking experienced Thin Films Metals Module Development Engineers to join the Technology Development organization. The role will be defined by developing and delivering metals modules for advanced semiconductor technologies, leveraging a combination of in-depth hardware knowledge and process expertise to deliver modules that fulfill program process needs within the hardware capabilities. This is a hands-on technical role for results-oriented engineers who can formulate concise technical problem statements, establish a roadmap and timeline, lead with data and partner with stakeholders to deliver on-time results. Qualifications: Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: • Bachelor's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related STEM fields with 6+ years of experience OR • Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related STEM fields with 4+ years of experience OR • Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related STEM fields with 2+ years of experience   Experience in semiconductor manufacturing or process development includes one or more of the following: • Expertise in process optimization, defect reduction, and manufacturing process improvements for advanced technology nodes • Proficiency in Design of Experiments (DOE), Statistical Process Control (SPC), and structured problem-solving methodologies • Hands-on expertise in dry etch processes, material science, and equipment metrology • Technical experience with semiconductor manufacturing equipment and collaboration with suppliers to optimize hardware and materials   Preferred Qualifications: • Doctoral degree in a relevant engineering or science field • Experience with sub-10nm technology nodes and advanced device architectures like FinFET or Gate-All-Around (GAA) • Proven record of delivering process solutions in Technology Development (TD) and High Volume Manufacturing (HVM) • Cross-functional leadership experience for yield improvement, defect reduction, or technology ramp initiatives • Experience mentoring engineers and providing technical guidance • Strong ownership mindset with the ability to lead initiatives from concept through implementation     For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information            Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .     Annual Salary Range for jobs which could be performed in the US: $155,520.00-255,200.00 USD     The range displayed on this job posting reflects the minimum and ma