Skills this job asks for
NetworkingProduct managementPython
Add your CV (free) to see which of these your CV is missing.
Sponsorship verdict
Sponsorship possible
One solid signal, not two. Worth applying, and worth asking about sponsorship early.
-
✓
Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first.
-
?
The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
-
?
No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area.
-
✓
What Intel Corporation paid sponsored hires in similar roles211 certified filings for “Component Design Engineer” (Electronics Engineers, Except Computer) in CA: $125k–$167k, median $142k.
-
✓
Confirmed live todayWhen a source last listed this job as open.
Details and sources
- Employer is on a government sponsor record
- The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. Source: LCA disclosure data (US Department of Labor (OFLC)).
- No salary bar for this route
- H-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles
- 211 certified filings for “Component Design Engineer” (Electronics Engineers, Except Computer) in CA: $125k–$167k, median $142k. Most were filed at wage level III (43%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence. It is not legal advice and never a guarantee: the employer and the immigration authority decide. Sign in to factor in where you can already work.
About the role
Job Details:
Job Description:
As a Silicon Photonics (SiPho) Component Design Engineer, you will join Intel Foundry's Silicon Photonics Process Development and Manufacturing (SPDM) team, which is driving process innovation and enabling the next generation of optical interconnect technologies. Since pioneering the world's first heterogeneous silicon laser nearly a decade ago, Intel has continued to lead the industry through advanced technology development and scalable high-volume manufacturing.
Our team is committed to expanding Intel Foundry's Silicon Photonics platform to support customer solutions across data center communications, co-packaged optics, and next-generation optical networking technologies ranging from 400G to 3.2T+ and beyond.
In this role, you will contribute to the development and optimization of silicon photonic components that power cutting-edge optical communication systems. You will collaborate with multidisciplinary engineering teams to design, characterize, and improve photonic devices while advancing Intel Foundry's silicon photonics technology roadmap.
Key Responsibilities
Photonic Component Design and Development
• Design, simulate, and support the development of photonic components, including lasers, modulators, high-speed photodetectors, passive devices, and waveguide structures.
• Contribute to photonic integrated circuit (PIC) design and architecture evaluations.
Device Optimization and Analysis
• Perform simulations, tolerance studies, and design evaluations to improve device performance, manufacturability, and reliability.
• Apply established modeling methodologies and design best practices to optimize photonic components.
Test Chip Development and Validation
• Support test chip execution activities, including design implementation, layout coordination, tape-out preparation, and silicon validation.
• Collaborate with fabrication and test teams to ensure successful design realization.
Characterization and Data Analysis
• Analyze characterization and test data to identify performance trends, root causes, and opportunities for design enhancement.
• Support the implementation of design improvements based on experimental results.
Modeling and Methodology Development
• Contribute to photonic device models, simulation workflows, and automation tools.
• Drive improvements in test methodologies and engineering processes to increase development efficiency.
Research and Technology Innovation
• Evaluate emerging photonic technologies and support proof-of-concept demonstrations.
• Contribute to intellectual property development through patents, technical publications, and innovation activities.
Qualifications:
Minimum Qualifications:
• PhD in Electrical Engineering, Physics, or a related technical discipline with 2+ years of experience in silicon photonic device design, simulation, characterization, or related research environments;
or
• Master's degree in a related field with 4+ years of relevant experience.
• Experience in one or more of the following areas:
• High-speed photonic devices, including optical modulators and photodetectors;
• Photonic design and simulation using tools such as Sentaurus, Silvaco, Lumerical, HFSS, ADS, RSoft, or equivalent;
• Photonic device testing and characterization; data analysis using MATLAB, Python, JMP, or similar tools;
• Photonic layout design using Cadence, KLayout, or comparable design environments.
Preferred Qualifications:
• Strong analytical and problem-solving skills with the ability to work effectively in a collaborative, cross-functional engineering environment.
• Experience with silicon photonic modulator or detector design.
• Familiarity with micro-ring modulators or advanced photonic materials such as BTO, TFLN, or III-V integrati
Apply on employer site ↗