ATD MIHL Equipment Development Engineer

Job Details: Job Description: The Role and Impact Join Intel's Packaging Module Development team as a Packaging Module Development Engineer and contribute to advancing innovative assembly and packaging technologies. In this role, you will develop and optimize processes and equipment to support next-generation packaging solutions. Your work will directly enhance manufacturing efficiency, product reliability, and quality, enabling cutting-edge products that shape Intel's leadership in the semiconductor industry. Business Group Intel's Packaging Module Development team focuses on designing and refining assembly and packaging solutions for Intel's diverse product portfolio. Collaborating with cross-functional teams, this group drives innovation in manufacturing processes and delivers high-quality, reliable solutions that support Intel's mission to deliver world-class technologies to global markets. Key Responsibilities • Develop and optimize assembly processes and equipment to meet quality, reliability, cost, yield, productivity, and manufacturability goals. • Apply principles of Design of Experiments (DOE) and Statistical Process Control (SPC) to refine processes and specifications, documenting findings through technical reports. • Design and maintain equipment to evaluate packaging technologies under simulated field conditions, such as temperature cycles, humidity, heat, and dynamic forces. • Ensure manufacturability of physical layouts in package design and oversee the lifecycle of manufacturing workflows. • Define material specifications and collaborate with supplier quality and procurement teams to ensure adherence to quality and performance benchmarks. • Innovate new techniques, tools, and quality screens to proactively identify and address packaging reliability challenges. • Set reliability benchmarks based on a thorough understanding of failure mechanisms and customer needs. • Lead problem-solving initiatives and drive continuous improvement in processes and equipment. • Provide expert consultation to internal teams and partners on packaging challenges and technical solutions. • Standardize equipment qualification practices and manufacturing quality systems to align with product milestones and mitigate technical risks. Qualifications: This position is not eligible for Intel immigration sponsorship.   Minimum Qualifications • Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field, and 3+ years of relevant experience OR Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field, and 2+ years of relevant experience OR PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field. Experience in the following: • Statistical Process Control (SPC) and Design of Experiments (DOE) principles. • Mechanical design software, such as SolidWorks or AutoCAD. • Mechanical drawings, Geometric Dimensioning, and Tolerancing principles. Preferred Qualifications Experience in the following: • Program management ability to lead technical innovation and manage complex, time-sensitive projects. • Semiconductor fabrication processes, packaging technologies, and robotics. • Supply chain management in a manufacturing or materials qualification environment. Take the next step in your career and join Intel's team of innovators dedicated to shaping the future of technology.            Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, a