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Intel Corporation

Module Development Engineer

US, Oregon, Hillsboro Posted today

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Skills this job asks for

Product managementLeadershipStatistics

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Sponsorship verdict

Sponsorship possible

One solid signal, not two. Worth applying, and worth asking about sponsorship early.

  • Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first.
  • The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
  • No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area.
  • What Intel Corporation paid sponsored hires in similar roles287 certified filings for “Process Engineer” (Materials Engineers) in OR: $113k–$133k, median $133k.
  • Confirmed live todayWhen a source last listed this job as open.
Details and sources
Employer is on a government sponsor record
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. Source: LCA disclosure data (US Department of Labor (OFLC)).
No salary bar for this route
H-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
What Intel Corporation paid sponsored hires in similar roles
287 certified filings for “Process Engineer” (Materials Engineers) in OR: $113k–$133k, median $133k. Most were filed at wage level III (87%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).

US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).

A verdict summarises public evidence. It is not legal advice and never a guarantee: the employer and the immigration authority decide. Sign in to factor in where you can already work.

About the role

Job Details: Job Description: The Role and Impact: As a Module Development Engineer, you will play a critical role in advancing Intel's semiconductor technologies by developing and optimizing complex manufacturing processes. You will design experiments, analyze results, and collaborate with cross-disciplinary teams to ensure the successful integration of innovative device architectures. Your contributions will directly impact the quality, scalability, and advancement of Intel's technology roadmap, driving industry-leading solutions in semiconductor manufacturing. Business Group: As part of Intel Foundry, you will join a forward-thinking team committed to delivering cutting-edge process technologies and enabling advancements in Intel's product roadmap. This group fosters collaboration across diverse scientific disciplines to ensure Intel's leadership in semiconductor innovation. By joining this dynamic team, you will help shape the future of computing and technology. Key Responsibilities: • Design, execute, and analyze experiments to develop next-generation semiconductor processes • Develop and optimize advanced manufacturing techniques, including material selection, parameter tuning, and equipment metrology • Perform pathfinding activities to enable innovative device architectures and align them with future roadmaps • Collaborate with cross-functional teams to integrate individual process steps into cohesive manufacturing flows • Partner with equipment and material suppliers to enhance process capabilities and deliver robust solutions • Recommend and implement equipment modifications to improve efficiency, scalability, and consistency • Drive ramp-up to high-volume manufacturing using Intel's Copy Exactly Methodology • Analyze trends in the semiconductor industry and align Intel's technology needs with emerging advancements Qualifications: Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.   Minimum Qualifications: • Master's degree in STEM related field with 5+ years of semiconductor processing and fabrication experience OR • PhD degree in STEM related field with 3+ years of semiconductor processing and fabrication experience   Preferred Qualifications: • Proven expertise in thin films processing or device fabrication with advanced hands-on development experience • In-depth knowledge of films processing methodologies and optimization techniques • Experience leading cross-functional teams and driving complex technical projects to successful outcomes • Familiarity with process control systems, variability sources, and advanced statistical methods • Demonstrated ability to communicate technical concepts effectively in a multidisciplinary environment   For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information            Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Benefits We offer

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