Sponsorship verdict
Sponsorship possible
One solid signal, not two. Worth applying, and worth asking about sponsorship early.
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✓
Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first.
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The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
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No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area.
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✓
Confirmed live todayWhen a source last listed this job as open.
Details and sources
- Employer is on a government sponsor record
- The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. Source: LCA disclosure data (US Department of Labor (OFLC)).
- No salary bar for this route
- H-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence. It is not legal advice and never a guarantee: the employer and the immigration authority decide. Sign in to factor in where you can already work.
About the role
Job Details:
Job Description:
Intel Corporation is one of the world's leading semiconductor companies, driving innovation that shapes the future of technology. With a legacy of over 50 years of engineering excellence, Intel is at the forefront of developing cutting-edge solutions in computing, connectivity, and advanced manufacturing. Our Advanced Packaging Technology Development – Substrate and Wafer Assembly (ATPD: SWA) organization is a global leader in delivering innovative, cost-effective substrate packaging solutions that power the devices and infrastructure of tomorrow. At Intel Arizona, we are proud to be part of a thriving technology hub where world-class talent comes together to solve some of the most complex challenges in semiconductor manufacturing.
Are you passionate about hands-on technical work and eager to be part of a team that is shaping the future of semiconductor manufacturing? Intel is seeking a Manufacturing Equipment Technician (MTE) - Front End Nights Shift - Shift 4 to join our Advanced Packaging Technology Development team in Chandler, Arizona . In this role, you will be at the heart of our manufacturing operations, ensuring the reliability and performance of advanced electromechanical systems used in semiconductor production. You will perform critical maintenance, troubleshooting, and calibration activities that directly impact Intel's production efficiency and technological advancement. This is an exciting opportunity to grow your technical career within a world-class organization that values innovation, continuous learning, and collaboration.
Shift Hours: Employees working Shift 4 (Sun-Tues and alternating Saturday nights) start their shift at 6:00 PM and finish at 6:30 AM.
Key Responsibilities:
• Perform electrical and mechanical troubleshooting to diagnose and resolve issues with advanced semiconductor manufacturing equipment.
• Execute setup, calibration, corrective, and preventative maintenance on production equipment, including wet chemistry, plating, and dry high-vacuum toolsets.
• Monitor tool performance and analyze equipment data to proactively identify and address issues before they impact production.
• Collaborate with engineering and cross-functional support teams to improve equipment reliability, reduce downtime, and drive operational excellence.
• Document maintenance activities, repair findings, and parts usage accurately using established systems and procedures.
• Lead or contribute to continuous improvement projects, focusing on equipment optimization, yield enhancements, and process efficiency.
• Support cleanroom operations while strictly adhering to safety protocols and maintaining full cleanroom attire at all times.
As a Successful Candidate, You Will Bring:
• Collaborative Spirit – You thrive in team environments and build strong working relationships across engineering and operations teams.
• Analytical Thinking – You approach problems with curiosity and a methodical mindset, always seeking the root cause.
• Clear Communication – You express ideas confidently, both verbally and in writing, ensuring alignment across teams.
• Adaptability – You embrace change and remain effective in a fast-paced, evolving manufacturing environment.
• Attention to Detail – You take pride in precision and accuracy, whether documenting findings or executing maintenance procedures.
• Growth Mindset – You are committed to continuous learning and actively seek opportunities to develop your skills and knowledge.
• Time Management – You prioritize effectively, managing multiple tasks without compromising quality or safety.
Ready to make your mark on the future of semiconductor technology? Apply today and join a team of innovators at Intel's Arizona campus who are passionate about
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