Jobs / United States / Intel Corporation
ATD MIHL Equipment Development Engineer
Intel Corporation · 🇺🇸 US, Arizona, Phoenix
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles78 certified filings for “Software Engineer” (Software Developers) in AZ: $111k–$140k, median $120k. Most were filed at wage level II (59%) — 2 lottery entries, ≈31% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: Join Intel's Packaging Module Development team and play a critical role in shaping the future of assembly packaging technologies. As a Packaging Module Development Engineer, you will design and optimize innovative processes and equipment to support Intel's roadmap for next-generation packaging solutions. Your work will directly impact manufacturing efficiency, product reliability, and technological advancements, ensuring Intel maintains its position as a global leader in the semiconductor industry. Business group Intel's Packaging Module Development team focuses on advancing assembly and packaging technologies that enable cutting-edge solutions across Intel's diverse product portfolio. This group collaborates with cross-functional teams to drive innovation in manufacturing processes, enhance product reliability, and support Intel's broader mission of delivering world-class technologies. Key Responsibilities of ATD Media Inspection Handling Laser Equipment Development Engineer - Develop and refine packaging processes and equipment to achieve quality, reliability, cost, yield, productivity, and manufacturability targets. - Apply Design of Experiments (DOE) principles and statistical methodologies to optimize processes and specifications, documenting findings through technical reports. - Design and maintain equipment to evaluate packaging technologies under simulated field conditions, such as heat, humidity, temperature cycles, and dynamic forces. - Ensure manufacturability of physical layouts in package design and oversee the lifecycle of manufacturing workflows. - Define material specifications and collaborate with supplier quality and procurement teams to ensure compliance with quality and performance benchmarks. - Innovate new techniques, tools, and quality screens to proactively identify and mitigate packaging reliability challenges. - Set reliability benchmarks based on a thorough understanding of failure mechanisms to meet customer needs. - Lead problem-solving initiatives and drive continuous improvement in equipment and processes. - Provide expert consultation to internal teams and partners on packaging challenges and technical solutions. - Standardize product qualification practices and manufacturing quality systems while managing technical risks aligned with product milestones. Qualifications: Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. This position is not eligible for Intel immigration sponsorship. Minimum Qualifications • Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience. • -OR- Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience. • -OR- PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 6+ month of relevant experience. Relevant experience should include any of following: - Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles. - Familiarity with mechanical drawings and Geometric Dimensioning and Tolerancing - Competency in mechanical design software such as SolidWorks or AutoCAD. Preferred Qualifications - Proven ability to lead technical innovation and manage complex, time-sensitive projects. - Understanding of semiconductor fabrication processes and packaging technolog