Jobs / United States / Intel Corporation
Module Engineering PhD Intern 2027
Intel Corporation · 🇺🇸 US, Oregon, Hillsboro
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles50 certified filings for “Engineering Manager” (Architectural and Engineering Managers) in OR: $182k–$209k, median $182k. Most were filed at wage level III (52%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: As a Module Engineering Intern within Intel's F25 Metals organization, you will work alongside engineers, technicians, and operations teams to support High Volume Manufacturing (HVM) of Intel's leading-edge semiconductor technologies. This role offers a unique opportunity to gain hands-on experience in semiconductor manufacturing while contributing to real-world engineering and operational challenges. Interns will own and execute a meaningful project focused on areas such as process improvement, manufacturing efficiency, equipment performance, automation, data analytics, quality systems, or operational excellence. In addition to their primary project, interns will participate in day-to-day engineering activities and engage with cross-functional stakeholders to gain a broad understanding of semiconductor manufacturing operations. Throughout the internship, you will learn how engineering decisions are made in a high-volume manufacturing environment by observing manufacturing workflows, analyzing data, identifying improvement opportunities, and communicating recommendations to technical and business partners. Interns are encouraged to explore multiple aspects of the organization through networking, mentorship, training, and collaboration across engineering disciplines. This internship provides opportunities to: • Lead a project from problem definition through execution and final presentation • Analyze manufacturing, equipment, and operational data to support decision making • Apply structured problem-solving and continuous improvement methodologies • Collaborate with engineers, technicians, quality teams, and operational stakeholders • Develop technical communication and presentation skills • Gain exposure to advanced semiconductor manufacturing technologies and operations Successful candidates will demonstrate curiosity, initiative, strong problem-solving abilities, and a desire to learn in a fast-paced manufacturing environment. This role is designed to provide meaningful industry experience while helping evaluate potential future engineers for full-time opportunities within Intel. Qualifications: Minimum Qualifications Qualifications are typically obtained through a combination of academic coursework, research experience, internships, and/or relevant industry experience. • Currently pursuing a PhD degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, or a related technical discipline. • Minimum GPA of 3.0. • Academic coursework or research experience in semiconductor processing, materials science, microelectronics, advanced materials, or a closely related field. • Availability to participate in a minimum 10 to 12-week summer internship. • 3+ months of educational, research, laboratory, internship, or industry experience. • Ability to work onsite in Hillsboro, Oregon. Preferred Qualifications • Previous internship, research, laboratory, project, or industry experience in engineering, manufacturing, data analytics, process development, or a related technical field. • Familiarity with semiconductor manufacturing, industrial operations, quality systems, continuous improvement, or complex technical environments. • Experience working with data analysis and visualization tools such as Python, JMP, MATLAB, Power BI, Excel, SQL, or similar platforms. • Knowledge of problem-solving and continuous improvement methodologies such as root cause analysis, 8D, SPC, Pareto analysis, Design of Experiments (DOE), Lean, or Six Sigma. • Demonstrated ability to analyze data, identify trends, and develop data-driven recommendations. • Experience breaking down complex problems into executable pl