Jobs / United States / Intel Corporation
Packaging Module Development Engineer
Intel Corporation · 🇺🇸 US, Oregon, Hillsboro
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles45 certified filings for “Packaging Engineer” (Electronics Engineers, Except Computer) in AZ: $115k–$143k, median $139k. Most were filed at wage level III (59%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: We are seeking a highly motivated, self-driven individual to join Materials Technology Development (MTD), bringing a strong technical background and a demonstrated ability to collaborate effectively across cross-functional teams to drive materials technology development for advanced packaging. The ideal candidate will have a strong educational foundation in Materials Science, such as Metallurgy or Polymer Science or Polymer Chemistry, with an excellent understanding of structure-property-performance correlations in materials and strong functional knowledge of materials characterization tools and techniques. The candidate must be able to apply sound technical problem-solving skills to resolve materials-process-equipment challenges in technology development and drive innovative materials solutions for advanced packaging at Intel. This role requires close collaboration with cross organizational stakeholders to deliver novel materials technologies that meet stringent quality and reliability requirements. The candidate must also be able to work effectively with external materials suppliers and possess strong communication and presentation skills, including the ability to formulate and present materials strategies and development plans in both internal and external forums Note: This role requires regular onsite presence to fulfill essential job responsibilities. Key Responsibilities: • Develops assembly materials, processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. • Optimizes and improves the efficiency of manufacturing of packages, developing innovative materials, processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements. • Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers. • Develops materials target specifications to ensure excellent integration of materials into packaging equipment and processes meeting quality and reliability targets. • Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows. • Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure materials technology, quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods. • Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging materials quality and reliability. • Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms. • Leads efforts towards innovating, problem solving, developing, and continuously improving materials, equipment and processes using experimental design and statistical methods. • Provides consultation concerning packaging problems and improvements in the packaging process, and responds to customer/client requests or events as they occur. • Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on materials/process/technology maturity for products towards key risk areas in meeting product milestones. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualification