Jobs / United States / Intel Corporation
Advanced Packaging Metrology Engineering Manager
Intel Corporation · 🇺🇸 US, Oregon, Hillsboro
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles50 certified filings for “Engineering Manager” (Architectural and Engineering Managers) in OR: $182k–$209k, median $182k. Most were filed at wage level III (52%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: Intel Corporation is a global technology leader at the forefront of semiconductor innovation, dedicated to creating world-changing technology that improves the lives of every person on the planet. Intel's Wafer-Level Assembly Technology Development (WATD) group is a dynamic, forward-thinking organization focused on developing next-generation packaging technologies. With a culture built on collaboration, inclusion, and relentless innovation, Intel offers an environment where your work truly matters — and where the future of technology is being written every day. We are seeking a visionary and technically accomplished Advanced Packaging Metrology Engineering Manager to lead a high-performing team of engineers at the cutting edge of advanced semiconductor packaging. In this pivotal role, you will drive innovation in wafer-level assembly technologies, champion manufacturing readiness, and deliver results that reinforce Intel's position as a global technology leader. You will shape the future of advanced packaging by enabling robust process pathways, executing long-term technology strategies, and cultivating a team culture rooted in excellence, accountability, and collaboration. Key Responsibilities: • Lead and inspire a team of engineers to develop advanced wafer processing and packaging solutions that push the boundaries of semiconductor technology. • Drive technology enablement, feasibility studies, and module improvement initiatives that align with Intel's strategic roadmap. • Ensure successful demonstrations of manufacturing capabilities at high volumes and manage seamless technology transfers to global manufacturing sites. • Partner with cross-functional teams — including integration, device, and yield engineering — to deliver process solutions that meet device specifications while optimizing safety, quality, and cost. • Collaborate with supplier executive management to identify and implement innovative concepts into manufacturing processes. • Execute long-term strategies for module engineering to support future technology needs and market demands. • Set clear, measurable team objectives and apply differentiated performance management to consistently drive results. • Coach, mentor, and develop engineers in skills growth, technology road mapping, and pathfinding for future innovations. • Foster a collaborative, inclusive, and psychologically safe team environment that encourages bold thinking and accountability. As a Successful Candidate, You Will Bring: • A Natural Leader — You inspire confidence, motivate teams, and bring out the best in the people around you. • A Clear Communicator — You articulate complex ideas with clarity and adapt your communication style to diverse audiences. • A Strategic Thinker — You see the big picture while staying grounded in the details that matter. • A Collaborative Partner — You thrive in cross-functional environments and build strong relationships with stakeholders at all levels. • A Coach and Mentor — You are genuinely invested in the growth and development of your team members. • An Innovative Problem-Solver — You approach challenges with curiosity, creativity, and a solutions-oriented mindset. • Resilient and Adaptable — You navigate ambiguity with composure and lead your team through change with confidence. • Inclusive and Empathetic — You champion diversity of thought and create environments where everyone feels valued and heard. Are you ready to lead a team that's shaping the future of semiconductor technology? Join Intel's WATD group in Hillsboro, Oregon, and make your mark on the technologies that connect and enrich lives worldwide. Qualifications: You must possess the below minimum qualifications to be initially considered for this pos