Jobs / United States / Intel Corporation
Packaging Research and Development Engineer
Intel Corporation · 🇺🇸 US, Arizona, Phoenix
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles45 certified filings for “Packaging Engineer” (Electronics Engineers, Except Computer) in AZ: $115k–$143k, median $139k. Most were filed at wage level III (59%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Last confirmed live 2 days agoWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: Substrate Packaging Technology Development (SPTD) is looking for a Packaging Research and Development Engineer to join the Module Engineering Backend Area specifically to be in charge of process and material development to scale advanced substrate packaging technology to enable further die disaggregation / heterogenous integration. This position requires most of time spent on the factory floor and/or interacting with equipment/material suppliers. The candidate will join and become part of a world class first of a kind embedded die packaging facility, learn advanced substrate manufacturing know-how, drive disruptive technology innovations, and be part of creating history in the substrate packaging industry. Responsibilities will include but not be limited to: - Define and establish equipment configurations, process specifications, and integrated process flow for new process technologies - Plan and conduct comprehensive DOEs to fundamentally characterize process window, and understand process / equipment / materials interactions - Drive continuous process improvements on process capability/stability, quality/reliability, cost/yield, automation, and productivity - Lead and participate in cross-functional and cross-organizational teams or work groups that support substrate technology development. The ideal candidate should exhibit the following behavioral traits and/or skills: - Written and verbal communication and teamwork skills. - Interact with equipment and materials suppliers. - Willingness to travel (some travel may be required, less than 5 percent) - Work with ambiguity and flexibility with respect to job roles and working hours is required. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates. Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences. Minimum qualifications: Candidate must possess at least one for the following: • Bachelor’s degree in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related and 5+ years of experience. • Master’s degree in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related and 3+ years of experience. • PhD degree in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related and 1+ years of experience. Experience listed above should be a combination of the following: • Semiconductor manufacturing experience • Semiconductor Technology development • Material Development Preferred qualifications: 1+ years of experience in the following: - Engineering troubleshooting and analytical skills on integrated technology issues and experience working with broad team of other process and integration engineers. - Experience owning process tools with knowledge of SPC PCS RFCs equipment troubleshooting statistical design of experiments and process development. - Experience working with a variety of organic/inorganic materials and processes as well as characterizations utilizing techniques such as DSC, TGA, D/TMA, Titration, ICPMS, FTIR, XPS, TOFSIMS, EDX, SEM, etc. is highly desirable. - Experience with statistical data analysis, JMP and JSL, Python, relational database structure and usage, machine learning. Become part of Intel's innovative team and take the next step in your career by applying today. Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Lo