Jobs / United States / Intel Corporation
Sort Interface Pathfinding and Development Engineer
Intel Corporation · 🇺🇸 US, Oregon, Hillsboro
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles287 certified filings for “Process Engineer” (Materials Engineers) in OR: $113k–$133k, median $133k. Most were filed at wage level III (87%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: Intel Corporation is one of the world's leading semiconductor companies, driving innovation across computing, connectivity, and artificial intelligence. With a bold vision to shape the future of technology, Intel is transforming how the world processes, stores, and communicates data. Our Advanced Packaging ,Test and Manufacturing (APTM) organization is at the forefront of this transformation, delivering industry-leading packaging and test technologies that power products across Client, Data Center, AI, Networking, and External Foundry markets. At Intel, we believe the next big thing starts with you. We are seeking a talented and driven Sort Interface Pathfinding and Development Engineer to join our Sort Interface Development team in Oregon. In this high-impact role, you will pioneer breakthrough silicon interface probing & test solutions that enable best-in-class die and wafer sort capabilities across leading-edge process nodes and advanced heterogeneous packaging platforms — including EMIB, EMIB-T, Foveros, and Foveros Direct. As Intel scales its Open System Foundry and OSAT (Outsourced Semiconductor Assembly and Test) business model, you will play an instrumental role in establishing world-class, customer-ready sort interface capabilities. You will lead electro-mechanical pathfinding, test hardware development, customer and supplier technical co-design, and probing process qualification to support both Intel's internal product roadmap and external Foundry customers. Key Responsibilities: • Formulate and execute rigorous Design of Experiments (DOE) to optimize and qualify next-generation probing technologies and contact architectures for wafer and die sort operations • Serve as the lead technical liaison for Foundry and OSAT customers, translating complex chiplet and package requirements into scalable sort interface specifications • Author industry-standard sort design rules and Interface Design Kits (IDKs) to streamline ecosystem integration for external fabless customers and design partners • Collaborate with customer design and DFT teams to architect test interface hardware, resolve technical gaps, and synchronize testability roadmaps • Partner with global Test Solution vendors and PCB suppliers to pioneer state-of-the-art probing capabilities • Direct supplier and pathfinding initiatives to align vendor roadmaps with internal efficiency and performance goals • Drive supplier accountability and manufacturing readiness to guarantee on-time hardware delivery for critical New Product Introductions (NPI) As a Successful Candidate, You Will Bring: • Collaborative mindset — you thrive working across cross-functional teams, customers, and global suppliers • Strong communicator — you can translate highly technical concepts into clear, actionable specifications for diverse audiences • Analytical thinker — you approach complex problems with curiosity, structure, and data-driven decision-making • Self-starter — you take initiative, drive projects forward, and hold yourself and others accountable • Customer-focused — you understand the importance of building trust and delivering value to external partners • Adaptable — you are comfortable navigating ambiguity and evolving priorities in a fast-paced, cutting-edge environment • Continuous learner — you stay current with emerging technologies and proactively seek opportunities to grow If you are passionate about pushing the boundaries of advanced packaging and test technology, and you want to make a meaningful impact on products that power the world's most advanced computing systems, we want to hear from you. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred quali