Jobs / United States / Intel Corporation
Senior SiPh Product Development Engineer
Intel Corporation · 🇺🇸 3 Locations
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles1 certified filing for “Product Engineer” (Electronics Engineers, Except Computer) in NM: $137k–$137k, median $137k. Most were filed at wage level III (100%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: Intel's Integrated Photonics Solutions (IPS) organization is driving the future of high-performance computing and networking through the development of advanced optical interconnect technologies built on Intel's silicon photonics platform. Position Overview Lead the development and industrialization of next-generation silicon photonics and high-speed optical products from concept through high-volume manufacturing. Drive technical execution, manufacturing readiness, and cross-functional decision-making to deliver products that meet performance, quality, cost, and schedule objectives. Key Responsibilities • Lead matrixed teams across design, fab, assembly, test, quality, and operations to define and execute the product Plan of Record (POR). • Drive end-to-end development of Photonic ICs (PICs), Electronic ICs (EICs), and manufacturing process technologies from concept through production ramp. • Balance technical tradeoffs, business priorities, cost, schedule, and risk to enable informed decision-making and successful product execution. • Identify and mitigate technical and execution risks through contingency planning and cross-functional alignment. • Drive manufacturing readiness, including wafer-start planning, qualification strategy, capacity analysis, customer sampling, and assembly/test site certification. • Serve as the primary interface to stakeholders and leadership, providing clear communication of product status, risks, and recommendations. • Build strong partnerships across organizations to accelerate execution and deliver business results. • Interface with fab, optical design, hardware, firmware, IC design, test, operations, and quality teams to ensure successful product development and manufacturing ramp. What We're Looking For You should demonstrate the following professional traits to be successful: • Strong collaborative leadership to effectively guide cross-functional, matrixed engineering and operational teams. • Analytical decision-making to balance complex technical tradeoffs with business priorities, costs, and schedule constraints. • Proactive communication and stakeholder management to clearly convey product status, risks, and recommendations to leadership. Qualifications: Minimum Qualifications • BS in Physics, Electrical Engineering, Optical Engineering, or a related discipline with 6+ years of relevant industry experience, or a Master's degree with 4+ years of relevant industry experience. • 3+ years of experience in one or more of the following: • High-speed optical component or product development • Silicon photonics development • Semiconductor fabrication process development • Wafer-level assembly or packaging development • Test development and validation Preferred Qualifications • Experience in silicon photonics, optical transceivers, or semiconductor product development, plus 2 or more of the following skills: • 3+ years of semiconductor fab process experience • 3+ years of assembly, packaging, or manufacturing process experience • Proven track record of leading cross-functional engineering teams and successfully transitioning products from development to high-volume manufacturing Join us in shaping the future of technology by bringing your expertise and passion to Intel's Silicon Photonic Design team. Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: US, California, Santa Clara, US, New Mexico, Albuquerque Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and vete