Jobs / United States / Intel Corporation
Hardware Engineer
Intel Corporation · 🇺🇸 US, California, Santa Clara
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles20 certified filings for “Graphics Hardware Engineer” (Computer Hardware Engineers) in CA: $136k–$199k, median $167k. Most were filed at wage level IV (50%) — 4 lottery entries, ≈61% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful. Job Responsibilities: • Support hardware design of an optical transceiver and evaluation boards meeting product specifications, including schematic capture, circuit simulation, PCB design guidance, DFM review and design verification testing. • Expertise in designing 100G/lane and 200G/lane module PCBA, own the schematic and layout execution, experience with designing PDN for high-speed DSP, RFICs, manage PI and SI requirements. • Experience with 100Gbps+ DSP, Driver, TIA, uControllers, DACs, ADCs, Voltage regulators, etc. • Key contributor to Product Requirements, Owns PCBA design from concept phase to full final design and EVT/DVT phase of the product. • Understand electrical and optical requirements and specifications of optical transceiver MSA. Like 800G DR8/2xFR4, 1.6T DR8/2xFR4, 800G LPO, 1.6T LRO etc. • Maintain documentation of a hardware design specification, Pass design check list prior to tape out, BOM specifications and work with NPI team to build PCBA. • Lead design reviews and present design summary to management, highlight risks with mitigation plans. • Interface and work collaboratively with mechanical engineers, optical engineers, Photonics engineer, firmware engineers, process engineers and test engineers. • Design and coordinate with PI/SI engineers to simulate high-speed interfaces, RF traces, dc and ac PI analysis, etc. 100Gbps, 200Gbps NRZ and PAM4 signaling. • Interact with program manager, buyer/planner and suppliers to make sure designed parts are available in a timely manner for build. • Troubleshooting and performance optimization of the sub-system/transceiver module board. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your degree, research and or relevant previous job and or internship experiences. Required Skills: Bachelor’s degree & 4+ years of experience or Master's degree & 3+ years of experience or PhD & 0 years in Electrical Engineering or similar STEM field. 3+ years of experience in the following: • HW/circuit design, Schematic design and Layout floor planning. • Experienced in Cadence tools for schematic and layout. • High density and high-speed multiple-layer board design. • Voltage regulator, uController, DAC/ADCs component selection, design and layout optimization to meet product requirements. • PCB and product bring up, laboratory optical and electrical measurement skills. • High speed Tline design and layout guidelines (25-50G NRZ, 100Gbps PAM4 and above) Preferred Skills: • Experience working with high volume PCB/substrate fab houses. Selecting PCB stackup that meets product requirement. • Experience with electronics CAD tools and modeling. Experience in PI and SI simulations is a plus. • Knowledge of transceiver/test board electrical design principles, including module architecture, high speed signal integrity, crosstalk, power integrity, noise, soft start