Jobs / United States / Intel Corporation
Silicon Photonics Test Engineer
Intel Corporation · 🇺🇸 US, California, Santa Clara
Sponsorship verdict
Sponsorship possible
One solid signal, not two — worth applying, and worth asking about sponsorship early.
- Employer is on a government sponsor recordThe US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
- The posting doesn’t mention sponsorshipSilence isn’t a refusal — ask the recruiter before investing much time.
- No salary bar for this routeH-1B has no fixed salary bar: the employer must pay at least the prevailing wage for the role and area. Cap-subject employers enter a lottery weighted by wage level. Source: https://www.federalregister.gov/documents/2025/12/29/2025-23853/weighted-selection-process-for-registrants-and-petitioners-seeking-to-file-cap-subject-h-1b, rules effective 2026-02-27.
- What Intel Corporation paid sponsored hires in similar roles211 certified filings for “Component Design Engineer” (Electronics Engineers, Except Computer) in CA: $125k–$167k, median $142k. Most were filed at wage level III (43%) — 3 lottery entries, ≈46% projected selection odds for cap-subject employers. Source: US Department of Labor LCA disclosure data (Oct 2025 – Jun 2026).
- Confirmed live todayWhen a source last listed this job as open.
US H-1B: cap-subject employers enter a lottery weighted by wage level — Level I gets 1 entry, Level IV gets 4 (DHS projected selection odds ≈15% at Level I to ≈61% at Level IV). Universities and non-profit research employers are cap-exempt. The $100,000 fee for new petitions from abroad is currently blocked by a court order (appeal pending).
A verdict summarises public evidence; it is not legal advice and never a guarantee — the employer and the immigration authority decide. Sign in to factor in where you can already work.
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Sponsor Radar — Intel Corporation
The US Department of Labor certified 1,731 H-1B/E-3 labor condition applications for this employer between Oct 2025 and Jun 2026 (latest Jun 2026) — the step every H-1B hire needs first. USCIS also records 1,112 H-1B approvals in FY2023. Source: LCA disclosure data (US Department of Labor (OFLC)).
Past sponsorship or register membership never guarantees sponsorship for this vacancy or for you. Full Sponsor Radar for Intel Corporation →
About the role
Job Details: Job Description: The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful. The team is seeking an experienced Silicon Photonics Test engineer for the development of Photonics Integrated Circuits (PIC), sub-system, reference module test stations to characterize and validate PIC, EIC and system performance. The candidate will be expected to collaborate with a cross functional product development team - HW, FW, PIC, EIC, Packaging and thermal, Optics and NPI. Job Responsibilities: • Develop, own, and execute comprehensive validation for Silicon Photonics products, including Photonic Integrated Circuits (PICs), Electrical Integrated Circuits (EICs), Optical sub-systems, Reference modules and advanced optical interconnect platforms. • Develop software and automation to control: VNAs, LCAs, AWGs, Oscilloscopes, Bit-error-rate testers, SMUs, Optical instrumentation. • Perform detailed characterization of Silicon Photonics devices, including Modulators, Photodetectors, Integrated lasers, Optical engines with RF Driver, TIA and ADC/DACs. • Characterize and validate the performance of 100G/lane and 200G/lane PAM4 Transmitters and Receivers, FRO/LRO/LPO Modules, Near-Packaged Optics (NPO) • Collect and analyze Small-signal performance, Large-signal performance, BER performance, Eye diagrams. • Cross-Functional Engineering Collaboration: Partner with teams spanning Silicon Photonics design, RFIC development, Packaging and thermal design, Firmware development, Manufacturing test, NPI and product engineering, • Support subsystem integration activities and drive technical problem-solving across multiple engineering disciplines. • Generate validation reports and clearly communicate findings and recommendations to development teams and leadership. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your degree, research and or relevant previous job and or internship experiences. Minimum Qualifications: Bachelors & 4+ years of experience OR Masters & 3+ years of experience OR PhD & 0 years in Electrical Engineering or STEM related field. 3+ years of hands-on experience testing and validating Silicon Photonics devices, RFICs, or optical communication subsystems. Experience working with: • Photonic Integrated Circuits (PICs), RF probes and probe stations, Evaluation-board-based optical subsystems, High-speed electrical and optical measurement equipment. • Experience testing optoelectronic devices, including Lasers, Modulators, Photodetectors, Optical interconnect technologies. • Experience developing automated test environments and data collection. • Strong programming skills for instrument control, automation, and data processing. • Experience using Python and data analytics tools for characterization and reporting. • Experience working with: VNA/LCA platforms, AWGs, DCAMs, High-speed oscilloscopes, Optical test equipment. • Experience performing RF probe calibration using calibration substrates and a